Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof

ABSTRACT

A memory-containing die includes a three-dimensional memory array, a memory dielectric material layer located on a first side of the three-dimensional memory array, and memory-side bonding pads. A logic die includes a peripheral circuitry configured to control operation of the three-dimensional memory array, logic dielectric material layers located on a first side of the peripheral circuitry, and logic-side bonding pads included in the logic dielectric material layers. The logic-side bonding pads includes a pad-level mesh structure electrically connected to a source power supply circuit within the peripheral circuitry and containing an array of discrete openings therethrough, and discrete logic-side bonding pads. The logic-side bonding pads are bonded to a respective one, or a respective subset, of the memory-side bonding pads. The pad-level mesh structure can be used as a component of a source power distribution network.

RELATED APPLICATIONS

The present application is a Continuation of U.S. patent applicationSer. No. 16/669,888, filed Oct. 31, 2019, which is a continuation ofU.S. patent application Ser. No. 16/243,469, filed on Jan. 9, 2019, nowU.S. Pat. No. 10,510,738, issued on Dec. 17, 2019, which is aContinuation-in-Part Application of U.S. patent application Ser. No.15/873,101, filed on Jan. 17, 2018, now U.S. Pat. No. 10,283,493, issuedon May 7, 2019, the entire contents of which are incorporated herein byreference.

FIELD

The present disclosure relates generally to the field of semiconductordevices and specifically to a three-dimensional memory device havingsupport-die-assisted source power distribution and methods of making thesame.

BACKGROUND

Recently, ultra-high density storage devices using three-dimensional(3D) memory stack structures have been proposed. For example, a 3D NANDstacked memory device can be formed from an array of an alternatingstack of insulating materials and spacer material layers that are formedas electrically conductive layers or replaced with electricallyconductive layers over a substrate containing peripheral devices (e.g.,driver/logic circuits). Memory openings are formed through thealternating stack, and are filled with memory stack structures, each ofwhich includes a vertical stack of memory elements and a verticalsemiconductor channel.

SUMMARY

According to an aspect of the present disclosure, a three-dimensionalmemory device is provided, which comprises: a memory-containing diecomprising a three-dimensional memory array, a memory dielectricmaterial layer located on a first side of the three-dimensional memoryarray, and memory-side bonding pads included in the memory dielectricmaterial layer and electrically connected to a respective node withinthe three-dimensional memory array; and a logic die comprising aperipheral circuitry configured to control operation of thethree-dimensional memory array, logic dielectric material layers locatedon a first side of the peripheral circuitry, and logic-side bonding padsincluded in the logic dielectric material layers and electricallyconnected to a respective node of the peripheral circuitry and bonded toa respective one, or a respective subset, of the memory-side bondingpads, wherein the logic-side bonding pads comprise: a pad-level meshstructure electrically connected to a source power supply circuit withinthe peripheral circuitry and including an array of discrete openingstherethrough; and discrete logic-side bonding pads electrically isolatedone from another and from the pad-level mesh structure.

According to another aspect of the present disclosure, a method offorming a three-dimensional memory device is provided, which comprises:providing a memory-containing die comprising a three-dimensional memoryarray, a memory dielectric material layer located on a first side of thethree-dimensional memory array, and memory-side bonding pads included inthe memory dielectric material layer and electrically connected to arespective node within the three-dimensional memory array; and providinga logic die comprising a peripheral circuitry configured to controloperation of the three-dimensional memory array, logic dielectricmaterial layers located on a first side of the peripheral circuitry, andlogic-side bonding pads included in the logic dielectric material layersand electrically connected to a respective node of the peripheralcircuitry, wherein the logic-side bonding pads comprise a pad-level meshstructure electrically connected to a source power supply circuit withinthe peripheral circuitry and including an array of discrete openingstherethrough, and discrete logic-side bonding pads electrically isolatedone from another and from the pad-level mesh structure; and bonding thelogic-side bonding pads to a respective one, or a respective subset, ofthe memory-side bonding pads.

According to an aspect of the present disclosure, a semiconductorstructure is provided, which comprises: a first die comprising athree-dimensional memory device including a three-dimensional array ofmemory elements, a first dielectric material layer overlying, orunderlying, the three-dimensional array of memory elements, and firstbonding pads included in the first dielectric material layer andelectrically connected to a respective node within the three-dimensionalmemory device; and a second die comprising a semiconductor substrate, aperipheral logic circuitry that includes complementary metal oxidesemiconductor (CMOS) devices located on the semiconductor substrate, asecond dielectric material layer overlying, or underlying, the CMOSdevices, and second bonding pads included in the second dielectricmaterial layer and electrically connected to a respective node withinthe CMOS devices, wherein the first bonding pads are bonded with thesecond bonding pads through copper interdiffusion to provide multiplebonded pairs of a respective first bonding pad and a respective secondbonding pad at an interface between the first die and the second die.

According to another aspect of the present disclosure, a semiconductorstructure comprises a first die comprising a three-dimensional memorydevice including a three-dimensional array of NAND memory elements, anda second die comprising a semiconductor substrate, a peripheral logiccircuitry that includes complementary metal oxide semiconductor (CMOS)devices located on the semiconductor substrate. The first die is bondedto the second die. Gate structures of the CMOS devices of the second dieare located between the three-dimensional array of NAND memory elementsof the first die and the semiconductor substrate of the second diecontaining active regions separated by a channel of the CMOS devices.

According to another aspect of the present disclosure, a method offorming a semiconductor structure includes providing a first diecomprising a three-dimensional memory device including athree-dimensional array of NAND memory elements, providing a second diecomprising a semiconductor substrate and peripheral logic circuitry thatincludes complementary metal oxide semiconductor (CMOS) devices locatedon the semiconductor substrate, and forming a bonded assembly by bondingthe first die to the second die.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a vertical cross-sectional view of a first exemplary structureafter formation of semiconductor devices, lower level dielectric layersincluding a silicon nitride layer, lower metal interconnect structures,and a planar semiconductor material layer on a semiconductor substrateaccording to a first embodiment of the present disclosure.

FIG. 2 is a vertical cross-sectional view of the first exemplarystructure after formation of a first-tier alternating stack of firstinsulating layers and first spacer material layers according to anembodiment of the present disclosure.

FIG. 3 is a vertical cross-sectional view of the first exemplarystructure after patterning first-tier staircase regions on thefirst-tier alternating stack and forming a first-tier retro-steppeddielectric material portion according to an embodiment of the presentdisclosure.

FIG. 4A is a vertical cross-sectional view of the first exemplarystructure after formation of first-tier memory openings and first tiersupport openings according to an embodiment of the present disclosure.

FIG. 4B is a horizontal cross-sectional view of the first exemplarystructure along the horizontal plane B-B′ in FIG. 4A. The zig-zagvertical plane A-A′ corresponds to the plane of the verticalcross-sectional view of FIG. 4A.

FIG. 5 is a vertical cross-sectional view of the first exemplarystructure after formation of sacrificial memory opening fill portionsand sacrificial support opening fill portions according to an embodimentof the present disclosure.

FIG. 6 is a vertical cross-sectional view of the first exemplarystructure after formation of a second-tier alternating stack of secondinsulating layers and second spacer material layers, a second-tierretro-stepped dielectric material portion, and a second insulating caplayer according to an embodiment of the present disclosure.

FIG. 7A is a vertical cross-sectional view of the first exemplarystructure after formation of inter-tier memory openings and inter-tiersupport openings according to an embodiment of the present disclosure.

FIG. 7B is a horizontal cross-sectional view of the first exemplarystructure along the horizontal plane B-B′ in FIG. 7A. The zig-zagvertical plane A-A′ corresponds to the plane of the verticalcross-sectional view of FIG. 7A.

FIG. 8 is a vertical cross-sectional view of the first exemplarystructure after formation of memory stack structures according to anembodiment of the present disclosure.

FIGS. 9A-9H are sequential vertical cross-sectional views of aninter-tier memory opening during formation of a pillar channel portion,a memory stack structure, a dielectric core, and a drain regionaccording to an embodiment of the present disclosure.

FIG. 10A is a vertical cross-sectional view of the first exemplarystructure after formation of first through-stack via cavities accordingto an embodiment of the present disclosure.

FIG. 10B is a horizontal cross-sectional view of the first exemplarystructure along the horizontal plane B-B′ in FIG. 10A. The zig-zagvertical plane A-A′ corresponds to the plane of the verticalcross-sectional view of FIG. 10A.

FIG. 11 is a vertical cross-sectional view of the first exemplarystructure after formation of through-stack insulating material portionaccording to an embodiment of the present disclosure.

FIG. 12A is a vertical cross-sectional view of the first exemplarystructure after formation of backside contact trenches according to anembodiment of the present disclosure.

FIG. 12B is a horizontal cross-sectional view of the first exemplarystructure along the horizontal plane B-B′ in FIG. 12A. The zig-zagvertical plane A-A′ corresponds to the plane of the verticalcross-sectional view of FIG. 12A.

FIG. 13A is a vertical cross-sectional view of the first exemplarystructure after replacement of sacrificial material layers withelectrically conductive layers and formation of insulating spacers andbackside contact via structures according to an embodiment of thepresent disclosure.

FIG. 13B is a horizontal cross-sectional view of the first exemplarystructure along the horizontal plane B-B′ in FIG. 13A. The zig-zagvertical plane A-A′ corresponds to the plane of the verticalcross-sectional view of FIG. 13A.

FIG. 14A is a vertical cross-sectional view of the first exemplarystructure after formation of drain contact via structures and word linecontact via structures according to an embodiment of the presentdisclosure.

FIG. 14B is a horizontal cross-sectional view of the first exemplarystructure along the horizontal plane B-B′ in FIG. 14A. The zig-zagvertical plane A-A′ corresponds to the plane of the verticalcross-sectional view of FIG. 14A.

FIG. 15 is a vertical cross-sectional view of the first exemplarystructure after formation of second through-track via cavities andthrough-dielectric via cavities according to an embodiment of thepresent disclosure.

FIG. 16A is a vertical cross-sectional view of the first exemplarystructure after formation of through-stack contact via structures andthrough-dielectric contact via structures according to an embodiment ofthe present disclosure.

FIG. 16B is a horizontal cross-sectional view of the first exemplarystructure along the horizontal plane B-B′ in FIG. 16A. The zig-zagvertical plane A-A′ corresponds to the plane of the verticalcross-sectional view of FIG. 16A.

FIG. 17 is a vertical cross-sectional view of the first exemplarystructure after formation of upper metal line structures duringmanufacture of a first die according to an embodiment of the presentdisclosure.

FIG. 18 is a vertical cross-sectional view of an alternative embodimentof the first exemplary structure during manufacture of a first dieaccording to an embodiment of the present disclosure.

FIG. 19 is a vertical cross-sectional view of a second exemplarystructure that can be used to provide a second die according to anembodiment of the present disclosure.

FIG. 20 is a vertical cross-sectional view of the second exemplarystructure after thinning the backside of a semiconductor substrateaccording to an embodiment of the present disclosure.

FIG. 21 is a vertical cross-section view of the alternate embodiment ofthe first exemplary structure after formation of first bonding padsaccording to an embodiment of the present disclosure.

FIG. 22 is a vertical cross-sectional view of a first exemplary bondedassembly formed by bonding the alternative embodiment of the firstexemplary structure of FIG. 21 and the second exemplary structure ofFIG. 20 according to an embodiment of the present disclosure.

FIG. 23 is a vertical cross-sectional view of the first exemplary bondedassembly after formation of a through-substrate via structure and abonding pad according to an embodiment of the present disclosure.

FIG. 24 is a vertical cross-sectional view of an alternative embodimentof the first exemplary bonded assembly formed by bonding the firstexemplary structure of FIG. 17 as modified by formation of first bondingpads and the second exemplary structure of FIG. 20 according to anembodiment of the present disclosure.

FIG. 25 is a vertical cross-sectional view of the alternative embodimentof the first exemplary bonded assembly after formation of athrough-substrate via structure and a bonding pad according to anembodiment of the present disclosure.

FIG. 26 is a vertical cross-sectional view of a first die and a seconddie prior to bonding according to an embodiment of the presentdisclosure.

FIG. 27 is a vertical cross-sectional view of a second exemplary bondedassembly according to an embodiment of the present disclosure.

FIG. 28 is a vertical cross-sectional view of an alternative embodimentof the second exemplary bonded assembly according to an embodiment ofthe present disclosure.

FIG. 29 is a vertical cross-sectional view of a third exemplary bondedassembly of a first die, a second die, and a third die according to anembodiment of the present disclosure.

FIGS. 30A-30F are sequential vertical cross-sectional views of anexemplary structure during bonding of two dies according to anembodiment of the present disclosure.

FIGS. 31A-31D illustrate various configurations of areal overlap in abonded assembly of a first die and a second die according to variousembodiments of the present disclosure.

FIG. 32 is a layout of a logic die that can be used as one of bondeddies in a bonded assembly according to an embodiment of the presentdisclosure.

FIG. 33 is a layout of a first magnified region M1 within the logic dieof FIG. 32 .

FIG. 34 is a first exemplary layout of a second magnified region M2within the first magnified region M1 of FIG. 33 at a first metal linelevel and a first metal via level according to an embodiment of thepresent disclosure.

FIG. 35 is the first exemplary layout of the second magnified region M2at the first metal via level and at a second metal line level accordingto an embodiment of the present disclosure.

FIG. 36 is the first exemplary layout of the second magnified region M2at the second metal line level and at a pad connection level accordingto an embodiment of the present disclosure.

FIG. 37 is the first exemplary layout of the second magnified region M2at the pad connection level and at a metal pad level according to anembodiment of the present disclosure.

FIG. 38 is a vertical cross-sectional view along the verticalcross-sectional plane X-X′ of FIGS. 34, 35, 36, and 37 of the secondmagnified region M2 according to an embodiment of the presentdisclosure.

FIG. 39 is a plan view of components of a source power distributionnetwork at the levels of the second metal line level, the pad connectionlevel, and the metal pad level within the second magnified region M2according to an embodiment of the present disclosure.

FIG. 40 is a second exemplary layout of the second magnified region M2within the first magnified region M1 of FIG. 33 at a first metal linelevel and a first metal via level according to an embodiment of thepresent disclosure.

FIG. 41 is the second exemplary layout of the second magnified region M2at the first metal via level and at a second metal line level accordingto an embodiment of the present disclosure.

FIG. 42 is the second exemplary layout of the second magnified region M2at the second metal line level and at a pad connection level accordingto an embodiment of the present disclosure.

FIG. 43 is the second exemplary layout of the second magnified region M2at the pad connection level and at a metal pad level according to anembodiment of the present disclosure.

FIG. 44 is a vertical cross-sectional view along the verticalcross-sectional plane X-X′ of FIGS. 40, 41, 42, and 43 of the secondmagnified region M2 according to an embodiment of the presentdisclosure.

FIG. 45 is a vertical cross-sectional view along the verticalcross-sectional plane Y-Y′ of FIGS. 40, 41, 42, and 43 of the secondmagnified region M2 according to an embodiment of the presentdisclosure.

DETAILED DESCRIPTION

As three-dimensional memory devices scale to smaller device dimensions,the device area for peripheral devices (which can be referred tointerchangeably as driver devices, driver circuits, logic circuitry,logic devices, peripheral circuits, etc.) can take up a significantportion of the total chip area. The peripheral logic circuitry providescontrol of the various nodes of the memory devices. Typically,complementary metal oxide semiconductor (CMOS) devices are formed on asame substrate as the three-dimensional memory device. Manufacture of athree-dimensional memory array typically involves many high temperatureprocessing steps, such as activation anneals and high temperature layerdeposition steps. Such high temperature processing steps have an adverseimpact on logic devices formed on a same substrate as thethree-dimensional memory array. However, degradation of CMOS devices dueto collateral thermal cycling and hydrogen diffusion during manufactureof the three-dimensional memory device places a severe constraint onperformance of the support circuitry including the CMOS devices.However, high performance peripheral devices are necessary to providehigh performance for a three-dimensional memory device. Further,performance of the three-dimensional memory device can be significantlydegraded due to voltage drops in a power distribution network such as asource voltage distribution network. The embodiments of the presentdisclosure provide a peripheral circuit die containing logic devices,such as CMOS devices, which is bonded to the memory-containing diecontaining a three-dimensional memory device. This configuration avoidsor reduces the negative effect of the high temperature processing stepson the logic devices.

The embodiments of the present disclosure can be used to form varioussemiconductor devices such as three-dimensional monolithic memory arraydevices comprising a plurality of NAND memory strings. The drawings arenot drawn to scale. Multiple instances of an element may be duplicatedwhere a single instance of the element is illustrated, unless absence ofduplication of elements is expressly described or clearly indicatedotherwise.

Ordinals such as “first,” “second,” and “third” are used merely toidentify similar elements, and different ordinals may be used across thespecification and the claims of the instant disclosure. As used herein,a first element located “on” a second element can be located on theexterior side of a surface of the second element or on the interior sideof the second element. As used herein, a first element is located“directly on” a second element if there exist a physical contact betweena surface of the first element and a surface of the second element. Asused herein, an “in-process” structure or a “transient” structure refersto a structure that is subsequently modified.

As used herein, a “layer” refers to a material portion including aregion having a thickness. A layer may extend over the entirety of anunderlying or overlying structure, or may have an extent less than theextent of an underlying or overlying structure. Further, a layer may bea region of a homogeneous or inhomogeneous continuous structure that hasa thickness less than the thickness of the continuous structure. Forexample, a layer may be located between any pair of horizontal planesbetween or at a top surface and a bottom surface of the continuousstructure. A layer may extend horizontally, vertically, and/or along atapered surface. A substrate may be a layer, may include one or morelayers therein, and/or may have one or more layer thereupon, thereabove,and/or therebelow.

As used herein, a “memory level” or a “memory array level” refers to thelevel corresponding to a general region between a first horizontal plane(i.e., a plane parallel to the top surface of the substrate) includingtopmost surfaces of an array of memory elements and a second horizontalplane including bottommost surfaces of the array of memory elements. Asused herein, a “through-stack” element refers to an element thatvertically extends through a memory level.

As used herein, a “semiconducting material” refers to a material havingelectrical conductivity in the range from 1.0×10⁻⁶ S/cm to 1.0×10⁵ S/cm.As used herein, a “semiconductor material” refers to a material havingelectrical conductivity in the range from 1.0×10⁻⁶ S/cm to 1.0×10⁵ S/cmin the absence of electrical dopants therein, and is capable ofproducing a doped material having electrical conductivity in a rangefrom 1.0 S/cm to 1.0×10⁵ S/cm upon suitable doping with an electricaldopant. As used herein, an “electrical dopant” refers to a p-type dopantthat adds a hole to a valence band within a band structure, or an n-typedopant that adds an electron to a conduction band within a bandstructure. As used herein, a “conductive material” refers to a materialhaving electrical conductivity greater than 1.0×10⁵ S/cm. As usedherein, an “insulating material” or a “dielectric material” refers to amaterial having electrical conductivity less than 1.0×10⁻⁶ S/cm. As usedherein, a “heavily doped semiconductor material” refers to asemiconductor material that is doped with electrical dopant at asufficiently high atomic concentration to become a conductive material,i.e., to have electrical conductivity greater than 1.0×10⁵ S/cm. A“doped semiconductor material” may be a heavily doped semiconductormaterial, or may be a semiconductor material that includes electricaldopants (i.e., p-type dopants and/or n-type dopants) at a concentrationthat provides electrical conductivity in the range from 1.0×10⁻⁶ S/cm to1.0×10⁵ S/cm. An “intrinsic semiconductor material” refers to asemiconductor material that is not doped with electrical dopants. Thus,a semiconductor material may be semiconducting or conductive, and may bean intrinsic semiconductor material or a doped semiconductor material. Adoped semiconductor material can be semiconducting or conductivedepending on the atomic concentration of electrical dopants therein. Asused herein, a “metallic material” refers to a conductive materialincluding at least one metallic element therein. All measurements forelectrical conductivities are made at the standard condition.

A monolithic three-dimensional memory array is one in which multiplememory levels are formed above a single substrate, such as asemiconductor wafer, with no intervening substrates. The term“monolithic” means that layers of each level of the array are directlydeposited on the layers of each underlying level of the array. Incontrast, two dimensional arrays may be formed separately and thenpackaged together to form a non-monolithic memory device. For example,non-monolithic stacked memories have been constructed by forming memorylevels on separate substrates and vertically stacking the memory levels,as described in U.S. Pat. No. 5,915,167 titled “Three-dimensionalStructure Memory.” The substrates may be thinned or removed from thememory levels before bonding, but as the memory levels are initiallyformed over separate substrates, such memories are not true monolithicthree-dimensional memory arrays. The substrate may include integratedcircuits fabricated thereon, such as driver circuits for a memory device

Three-dimensional memory devices of various embodiments of the presentdisclosure include a monolithic three-dimensional NAND string memorydevice, and can be fabricated using the various embodiments describedherein. The monolithic three-dimensional NAND string is located in amonolithic, three-dimensional array of NAND strings located over thesubstrate. At least one memory cell in the first device level of thethree-dimensional array of NAND strings is located over another memorycell in the second device level of the three-dimensional array of NANDstrings.

Referring to FIG. 1 , a first exemplary structure according to anembodiment of the present disclosure is illustrated. The first exemplarystructure includes a semiconductor substrate 8, and semiconductordevices 710 formed thereupon. The semiconductor substrate 8 includes asubstrate semiconductor layer 9 at least at an upper portion thereof.Shallow trench isolation structures 720 can be formed in an upperportion of the substrate semiconductor layer 9 to provide electricalisolation among the semiconductor devices. The semiconductor devices 710can include, for example, field effect transistors including respectivetransistor active regions 742 (i.e., source regions and drain regions),channel regions 746 and gate structures 750. The field effecttransistors may be arranged in a CMOS configuration. Each gate structure750 can include, for example, a gate dielectric 752, a gate electrode754, a dielectric gate spacer 756 and a gate cap dielectric 758. Thesemiconductor devices can include any semiconductor circuitry to supportoperation of a memory structure to be subsequently formed, which istypically referred to as a driver circuitry, which is also known asperipheral circuitry. As used herein, a peripheral circuitry refers toany, each, or all, of word line decoder circuitry, word line switchingcircuitry, bit line decoder circuitry, bit line sensing and/or switchingcircuitry, power supply/distribution circuitry, data buffer and/orlatch, or any other semiconductor circuitry that can be implementedoutside a memory array structure for a memory device. For example, thesemiconductor devices can include word line switching devices forelectrically biasing word lines of three-dimensional memory structuresto be subsequently formed.

Dielectric material layers are formed over the semiconductor devices,which is herein referred to as lower level dielectric layers 760. Thelower level dielectric layers 760 constitute a dielectric layer stack inwhich each lower level dielectric layer 760 overlies or underlies otherlower level dielectric layers 760. The lower level dielectric layers 760can include, for example, a dielectric liner 762 such as a siliconnitride liner that blocks diffusion of mobile ions and/or applyappropriate stress to underlying structures, at least one firstdielectric material layer 764 that overlies the dielectric liner 762, asilicon nitride layer (e.g., hydrogen diffusion barrier) 766 thatoverlies the dielectric material layer 764, and at least one seconddielectric layer 768.

The dielectric layer stack including the lower level dielectric layers760 functions as a matrix for lower metal interconnect structures 780that provide electrical wiring between the various nodes of thesemiconductor devices and landing pads for through-stack contact viastructures to be subsequently formed. The lower metal interconnectstructures 780 are included within the dielectric layer stack of thelower level dielectric layers 760, and comprise a lower metal linestructure located under and optionally contacting a bottom surface ofthe silicon nitride layer 766.

For example, the lower metal interconnect structures 780 can be includedwithin the at least one first dielectric material layer 764. The atleast one first dielectric material layer 764 may be a plurality ofdielectric material layers in which various elements of the lower metalinterconnect structures 780 are sequentially included. Each dielectricmaterial layer of the at least one first dielectric material layer 764may include any of doped silicate glass, undoped silicate glass,organosilicate glass, silicon nitride, silicon oxynitride, anddielectric metal oxides (such as aluminum oxide). In one embodiment, theat least one first dielectric material layer 764 can comprise, orconsist essentially of, dielectric material layers having dielectricconstants that do not exceed the dielectric constant of undoped silicateglass (silicon oxide) of 3.9.

The lower metal interconnect structures 780 can include various devicecontact via structures 782 (e.g., source and drain electrodes whichcontact the respective source and drain nodes of the device or gateelectrode contacts), intermediate lower metal line structures 784, lowermetal via structures 786, and topmost lower metal line structures 788that are configured to function as landing pads for through-stackcontact via structures to be subsequently formed. In this case, the atleast one first dielectric material layer 764 may be a plurality ofdielectric material layers that are formed level by level whileincorporating components of the lower metal interconnect structures 780within each respective level. For example, single damascene processesmay be used to form the lower metal interconnect structures 780, andeach level of the lower metal via structures 786 may be included withina respective via level dielectric material layer and each level of thelower level metal line structures (784, 788) may be included within arespective line level dielectric material layer. Alternatively, a dualdamascene process may be used to form integrated line and viastructures, each of which includes a lower metal line structure and atleast one lower metal via structure.

The topmost lower metal line structures 788 can be formed within atopmost dielectric material layer of the at least one first dielectricmaterial layer 764 (which can be a plurality of dielectric materiallayers). Each of the lower metal interconnect structures 780 can includea metallic nitride liner 78A and a metal fill portion 78B. Each metallicnitride liner 78A can include a conductive metallic nitride materialsuch as TiN, TaN, and/or WN. Each metal fill portion 78B can include anelemental metal (such as Cu, W, Al, Co, Ru) or an intermetallic alloy ofat least two metals. Top surfaces of the topmost lower metal linestructures 788 and the topmost surface of the at least one firstdielectric material layer 764 may be planarized by a planarizationprocess, such as chemical mechanical planarization. In this case, thetop surfaces of the topmost lower metal line structures 788 and thetopmost surface of the at least one first dielectric material layer 764may be within a horizontal plane that is parallel to the top surface ofthe substrate 8.

The silicon nitride layer 766 can be formed directly on the top surfacesof the topmost lower metal line structures 788 and the topmost surfaceof the at least one first dielectric material layer 764. Alternatively,a portion of the first dielectric material layer 764 can be located onthe top surfaces of the topmost lower metal line structures 788 belowthe silicon nitride layer 766. In one embodiment, the silicon nitridelayer 766 is a substantially stoichiometric silicon nitride layer whichhas a composition of Si₃N₄. A silicon nitride material formed by thermaldecomposition of a silicon nitride precursor is preferred for thepurpose of blocking hydrogen diffusion. In one embodiment, the siliconnitride layer 766 can be deposited by a low pressure chemical vapordeposition (LPCVD) using dichlorosilane (SiH₂Cl₂) and ammonia (NH₃) asprecursor gases. The temperature of the LPCVD process may be in a rangefrom 750 degrees Celsius to 825 degrees Celsius, although lesser andgreater deposition temperatures can also be used. The sum of the partialpressures of dichlorosilane and ammonia may be in a range from 50 mTorrto 500 mTorr, although lesser and greater pressures can also be used.The thickness of the silicon nitride layer 766 is selected such that thesilicon nitride layer 766 functions as a sufficiently robust hydrogendiffusion barrier for subsequent thermal processes. For example, thethickness of the silicon nitride layer 766 can be in a range from 6 nmto 100 nm, although lesser and greater thicknesses may also be used.

The at least one second dielectric material layer 768 may include asingle dielectric material layer or a plurality of dielectric materiallayers. Each dielectric material layer of the at least one seconddielectric material layer 768 may include any of doped silicate glass,undoped silicate glass, and organosilicate glass. In one embodiment, theat least one first second material layer 768 can comprise, or consistessentially of, dielectric material layers having dielectric constantsthat do not exceed the dielectric constant of undoped silicate glass(silicon oxide) of 3.9.

An optional layer of a metallic material and a layer of a semiconductormaterial can be deposited over, or within patterned recesses of, the atleast one second dielectric material layer 768, and is lithographicallypatterned to provide an optional planar conductive material layer 6 anda planar semiconductor material layer 10. The optional planar conductivematerial layer 6, if present, provides a high conductivity conductionpath for electrical current that flows into, or out of, the planarsemiconductor material layer 10. The optional planar conductive materiallayer 6 includes a conductive material such as a metal or a heavilydoped semiconductor material. The optional planar conductive materiallayer 6, for example, may include a tungsten layer having a thickness ina range from 3 nm to 100 nm, although lesser and greater thicknesses canalso be used. A metal nitride layer (not shown) may be provided as adiffusion barrier layer on top of the planar conductive material layer6. Layer 6 may function as a special source line in the completeddevice. Alternatively, layer 6 may comprise an etch stop layer and maycomprise any suitable conductive, semiconductor or insulating layer.

The planar semiconductor material layer 10 can include horizontalsemiconductor channels and/or source regions for a three-dimensionalarray of memory devices to be subsequently formed. The optional planarconductive material layer 6 can include a metallic compound materialsuch as a conductive metallic nitride (e.g., TiN) and/or a metal (e.g.,W). The thickness of the optional planar conductive material layer 6 maybe in a range from 5 nm to 100 nm, although lesser and greaterthicknesses can also be used. The planar semiconductor material layer 10includes a polycrystalline semiconductor material such as polysilicon ora polycrystalline silicon-germanium alloy. The thickness of the planarsemiconductor material layer 10 may be in a range from 30 nm to 300 nm,although lesser and greater thicknesses can also be used.

The planar semiconductor material layer 10 includes a semiconductormaterial, which can include at least one elemental semiconductormaterial, at least one III-V compound semiconductor material, at leastone II-VI compound semiconductor material, at least one organicsemiconductor material, and/or other semiconductor materials known inthe art. In one embodiment, the planar semiconductor material layer 10can include a polycrystalline semiconductor material (such aspolysilicon), or an amorphous semiconductor material (such as amorphoussilicon) that is converted into a polycrystalline semiconductor materialin a subsequent processing step (such as an anneal step). The planarsemiconductor material layer 10 can be formed directly above a subset ofthe semiconductor devices on the semiconductor substrate 8 (e.g.,silicon wafer). As used herein, a first element is located “directlyabove” a second element if the first element is located above ahorizontal plane including a topmost surface of the second element andan area of the first element and an area of the second element has anareal overlap in a plan view (i.e., along a vertical plane or directionperpendicular to the top surface of the substrate 8). In one embodiment,the planar semiconductor material layer 10 or portions thereof can bedoped with electrical dopants, which may be p-type dopants or n-typedopants. The conductivity type of the dopants in the planarsemiconductor material layer 10 is herein referred to as a firstconductivity type.

The optional planar conductive material layer 6 and the planarsemiconductor material layer 10 may be patterned to provide openings inareas in which through-stack contact via structures andthrough-dielectric contact via structures are to be subsequently formed.In one embodiment, the openings in the optional planar conductivematerial layer 6 and the planar semiconductor material layer 10 can beformed within the area of a memory array region 100, in which athree-dimensional memory array including memory stack structures is tobe subsequently formed. Further, additional openings in the optionalplanar conductive material layer 6 and the planar semiconductor materiallayer 10 can be formed within the area of a contact region 200 in whichcontact via structures contacting word line electrically conductivelayers are to be subsequently formed.

The region of the semiconductor devices 710 and the combination of thelower level dielectric layers 760 and the lower metal interconnectstructures 780 is herein referred to an underlying peripheral deviceregion 700, which is located underneath a memory-level assembly to besubsequently formed and includes peripheral devices for the memory-levelassembly. The lower metal interconnect structures 780 are included inthe lower level dielectric layers 760.

The lower metal interconnect structures 780 can be electricallyconnected to active nodes (e.g., transistor active regions 742 or gateelectrodes 754) of the semiconductor devices 710 (e.g., CMOS devices),and are located at the level of the lower level dielectric layers 760.Only a subset of the active nodes is illustrated in FIG. 1 for clarity.Through-stack contact via structures (not shown in FIG. 1 ) can besubsequently formed directly on the lower metal interconnect structures780 to provide electrical connection to memory devices to besubsequently formed. In one embodiment, the pattern of the lower metalinterconnect structures 780 can be selected such that the topmost lowermetal line structures 788 (which are a subset of the lower metalinterconnect structures 780 located at the topmost portion of the lowermetal interconnect structures 780) can provide landing pad structuresfor the through-stack contact via structures to be subsequently formed.

Referring to FIG. 2 , an alternating stack of first material layers andsecond material layers is subsequently formed. Each first material layercan include a first material, and each second material layer can includea second material that is different from the first material. In case atleast another alternating stack of material layers is subsequentlyformed over the alternating stack of the first material layers and thesecond material layers, the alternating stack is herein referred to as afirst-tier alternating stack. The level of the first-tier alternatingstack is herein referred to as a first-tier level, and the level of thealternating stack to be subsequently formed immediately above thefirst-tier level is herein referred to as a second-tier level, etc.

The first-tier alternating stack can include first insulating layers 132as the first material layers, and first spacer material layers as thesecond material layers. In one embodiment, the first spacer materiallayers can be sacrificial material layers that are subsequently replacedwith electrically conductive layers. In another embodiment, the firstspacer material layers can be electrically conductive layers that arenot subsequently replaced with other layers. While the presentdisclosure is described using embodiments in which sacrificial materiallayers are replaced with electrically conductive layers, in otherembodiments the spacer material layers are formed as electricallyconductive layers (thereby obviating the need to perform replacementprocesses).

In one embodiment, the first material layers and the second materiallayers can be first insulating layers 132 and first sacrificial materiallayers 142, respectively. In one embodiment, each first insulating layer132 can include a first insulating material, and each first sacrificialmaterial layer 142 can include a first sacrificial material. Analternating plurality of first insulating layers 132 and firstsacrificial material layers 142 is formed over the planar semiconductormaterial layer 10. As used herein, a “sacrificial material” refers to amaterial that is removed during a subsequent processing step. As usedherein, an alternating stack of first elements and second elementsrefers to a structure in which instances of the first elements andinstances of the second elements alternate. Each instance of the firstelements that is not an end element of the alternating plurality isadjoined by two instances of the second elements on both sides, and eachinstance of the second elements that is not an end element of thealternating plurality is adjoined by two instances of the first elementson both ends. The first elements may have the same thicknessthereamongst, or may have different thicknesses. The second elements mayhave the same thickness thereamongst, or may have different thicknesses.The alternating plurality of first material layers and second materiallayers may begin with an instance of the first material layers or withan instance of the second material layers, and may end with an instanceof the first material layers or with an instance of the second materiallayers. In one embodiment, an instance of the first elements and aninstance of the second elements may form a unit that is repeated withperiodicity within the alternating plurality.

The first-tier alternating stack (132, 142) can include first insulatinglayers 132 composed of the first material, and first sacrificialmaterial layers 142 composed of the second material, which is differentfrom the first material. The first material of the first insulatinglayers 132 can be at least one insulating material. Insulating materialsthat can be used for the first insulating layers 132 include, but arenot limited to silicon oxide (including doped or undoped silicateglass), silicon nitride, silicon oxynitride, organosilicate glass (OSG),spin-on dielectric materials, dielectric metal oxides that are commonlyknown as high dielectric constant (high-k) dielectric oxides (e.g.,aluminum oxide, hafnium oxide, etc.) and silicates thereof, dielectricmetal oxynitrides and silicates thereof, and organic insulatingmaterials. In one embodiment, the first material of the first insulatinglayers 132 can be silicon oxide.

The second material of the first sacrificial material layers 142 is asacrificial material that can be removed selective to the first materialof the first insulating layers 132. As used herein, a removal of a firstmaterial is “selective to” a second material if the removal processremoves the first material at a rate that is at least twice the rate ofremoval of the second material. The ratio of the rate of removal of thefirst material to the rate of removal of the second material is hereinreferred to as a “selectivity” of the removal process for the firstmaterial with respect to the second material.

The first sacrificial material layers 142 may comprise an insulatingmaterial, a semiconductor material, or a conductive material. The secondmaterial of the first sacrificial material layers 142 can besubsequently replaced with electrically conductive electrodes which canfunction, for example, as control gate electrodes of a vertical NANDdevice. In one embodiment, the first sacrificial material layers 142 canbe material layers that comprise silicon nitride.

In one embodiment, the first insulating layers 132 can include siliconoxide, and sacrificial material layers can include silicon nitridesacrificial material layers. The first material of the first insulatinglayers 132 can be deposited, for example, by chemical vapor deposition(CVD). For example, if silicon oxide is used for the first insulatinglayers 132, tetraethylorthosilicate (TEOS) can be used as the precursormaterial for the CVD process. The second material of the firstsacrificial material layers 142 can be formed, for example, CVD oratomic layer deposition (ALD).

The thicknesses of the first insulating layers 132 and the firstsacrificial material layers 142 can be in a range from 20 nm to 50 nm,although lesser and greater thicknesses can be used for each firstinsulating layer 132 and for each first sacrificial material layer 142.The number of repetitions of the pairs of a first insulating layer 132and a first sacrificial material layer 142 can be in a range from 2 to1,024, and typically from 8 to 256, although a greater number ofrepetitions can also be used. In one embodiment, each first sacrificialmaterial layer 142 in the first-tier alternating stack (132, 142) canhave a uniform thickness that is substantially invariant within eachrespective first sacrificial material layer 142.

A first insulating cap layer 170 is subsequently formed over the stack(132, 142). The first insulating cap layer 170 includes a dielectricmaterial, which can be any dielectric material that can be used for thefirst insulating layers 132. In one embodiment, the first insulating caplayer 170 includes the same dielectric material as the first insulatinglayers 132. The thickness of the insulating cap layer 170 can be in arange from 20 nm to 300 nm, although lesser and greater thicknesses canalso be used.

Referring to FIG. 3 , the first insulating cap layer 170 and thefirst-tier alternating stack (132, 142) can be patterned to form firststepped surfaces in the word line contact via region 200. The word linecontact via region 200 can include a respective first stepped area inwhich the first stepped surfaces are formed, and a second stepped areain which additional stepped surfaces are to be subsequently formed in asecond-tier structure (to be subsequently formed over a first-tierstructure) and/or additional tier structures. The first stepped surfacescan be formed, for example, by forming a mask layer with an openingtherein, etching a cavity within the levels of the first insulating caplayer 170, and iteratively expanding the etched area and verticallyrecessing the cavity by etching each pair of a first insulating layer132 and a first sacrificial material layer 142 located directlyunderneath the bottom surface of the etched cavity within the etchedarea. A dielectric material can be deposited to fill the first steppedcavity to form a first-tier retro-stepped dielectric material portion165. As used herein, a “retro-stepped” element refers to an element thathas stepped surfaces and a horizontal cross-sectional area thatincreases monotonically as a function of a vertical distance from a topsurface of a substrate on which the element is present. The first-tieralternating stack (132, 142) and the first-tier retro-stepped dielectricmaterial portion 165 collectively constitute a first-tier structure,which is an in-process structure that is subsequently modified.

Referring to FIGS. 4A and 4B, an inter-tier dielectric layer 180 may beoptionally deposited over the first-tier structure (132, 142, 165, 170).The inter-tier dielectric layer 180 includes a dielectric material suchas silicon oxide. The thickness of the inter-tier dielectric layer 180can be in a range from 30 nm to 300 nm, although lesser and greaterthicknesses can also be used. Locations of steps S in the first-tieralternating stack (132, 142) are illustrated as dotted lines.

First-tier memory openings 149 and first tier support openings 119 canbe formed. The first-tier memory openings 149 and the first-tier supportopenings 119 extend through the first-tier alternating stack (132, 142)at least to a top surface of the planar semiconductor material layer 10.The first-tier memory openings 149 can be formed in the memory arrayregion 100 at locations at which memory stack structures includingvertical stacks of memory elements are to be subsequently formed. Thefirst-tier support openings 119 can be formed in the word line contactvia region 200. For example, a lithographic material stack (not shown)including at least a photoresist layer can be formed over the firstinsulating cap layer 170 (and the optional inter-tier dielectric layer180, if present), and can be lithographically patterned to form openingswithin the lithographic material stack. The pattern in the lithographicmaterial stack can be transferred through the first insulating cap layer170 (and the optional inter-tier dielectric layer 180), and through theentirety of the first-tier alternating stack (132, 142) by at least oneanisotropic etch that uses the patterned lithographic material stack asan etch mask. Portions of the first insulating cap layer 170 (and theoptional inter-tier dielectric layer 180), and the first-tieralternating stack (132, 142) underlying the openings in the patternedlithographic material stack are etched to form the first-tier memoryopenings 149 and the first-tier support openings 119. In other words,the transfer of the pattern in the patterned lithographic material stackthrough the first insulating cap layer 170 and the first-tieralternating stack (132, 142) forms the first-tier memory openings 149and the first-tier support openings 119.

In one embodiment, the chemistry of the anisotropic etch process used toetch through the materials of the first-tier alternating stack (132,142) can alternate to optimize etching of the first and second materialsin the first-tier alternating stack (132, 142). The anisotropic etch canbe, for example, a series of reactive ion etches or a single etch (e.g.,CF₄/O₂/Ar etch). The sidewalls of the first-tier memory openings 149 andthe support openings 119 can be substantially vertical, or can betapered. Subsequently, the patterned lithographic material stack can besubsequently removed, for example, by ashing.

Optionally, the portions of the first-tier memory openings 149 and thefirst-tier support openings 119 at the level of the inter-tierdielectric layer 180 can be laterally expanded by an isotropic etch. Forexample, if the inter-tier dielectric layer 180 comprises a dielectricmaterial (such as borosilicate glass) having a greater etch rate thanthe first insulating layers 132 (that can include undoped silicateglass), an isotropic etch (such as a wet etch using HF) can be used toexpand the lateral dimensions of the first-tier memory openings at thelevel of the inter-tier dielectric layer 180. The portions of thefirst-tier memory openings 149 (and the first-tier support openings 119)located at the level of the inter-tier dielectric layer 180 may beoptionally widened to provide a larger landing pad for second-tiermemory openings to be subsequently formed through a second-tieralternating stack (to be subsequently formed prior to formation of thesecond-tier memory openings).

Referring to FIG. 5 , sacrificial memory opening fill portions 148 canbe formed in the first-tier memory openings 149, and sacrificial supportopening fill portions 118 can be formed in the first-tier supportopenings 119. For example, a sacrificial fill material layer isdeposited in the first-tier memory openings 149 and the first-tiersupport openings 119. The sacrificial fill material layer includes asacrificial material which can be subsequently removed selective to thematerials of the first insulator layers 132 and the first sacrificialmaterial layers 142. In one embodiment, the sacrificial fill materiallayer can include a semiconductor material such as silicon (e.g., a-Sior polysilicon), a silicon-germanium alloy, germanium, a III-V compoundsemiconductor material, or a combination thereof. Optionally, a thinetch stop layer (such as a silicon oxide layer having a thickness in arange from 1 nm to 3 nm) may be used prior to depositing the sacrificialfill material layer. The sacrificial fill material layer may be formedby a non-conformal deposition or a conformal deposition method. Inanother embodiment, the sacrificial fill material layer can includeamorphous silicon or a carbon-containing material (such as amorphouscarbon or diamond-like carbon) that can be subsequently removed byashing.

Portions of the deposited sacrificial material can be removed from abovethe first insulating cap layer 170 (and the optional inter-tierdielectric layer 180, if present). For example, the sacrificial fillmaterial layer can be recessed to a top surface of the first insulatingcap layer 170 (and the optional inter-tier dielectric layer 180) using aplanarization process. The planarization process can include a recessetch, chemical mechanical planarization (CMP), or a combination thereof.The top surface of the first insulating layer 170 (and optionally layer180 if present) can be used as an etch stop layer or a planarizationstop layer. Each remaining portion of the sacrificial material in afirst-tier memory opening 149 constitutes a sacrificial memory openingfill portion 148. Each remaining portion of the sacrificial material ina first-tier support opening 119 constitutes a sacrificial supportopening fill portion 118. The top surfaces of the sacrificial memoryopening fill portions 148 and the sacrificial support opening fillportions 118 can be coplanar with the top surface of the inter-tierdielectric layer 180 (or the first insulating cap layer 170 if theinter-tier dielectric layer 180 is not present). The sacrificial memoryopening fill portion 148 and the sacrificial support opening fillportions 118 may, or may not, include cavities therein.

Referring to FIG. 6 , a second-tier structure can be formed over thefirst-tier structure (132, 142, 170, 148, 118). The second-tierstructure can include an additional alternating stack of insulatinglayers and spacer material layers, which can be sacrificial materiallayers. For example, a second alternating stack (232, 242) of materiallayers can be subsequently formed on the top surface of the firstalternating stack (132, 142). The second stack (232, 242) includes analternating plurality of third material layers and fourth materiallayers. Each third material layer can include a third material, and eachfourth material layer can include a fourth material that is differentfrom the third material. In one embodiment, the third material can bethe same as the first material of the first insulating layer 132, andthe fourth material can be the same as the second material of the firstsacrificial material layers 142.

In one embodiment, the third material layers can be second insulatinglayers 232 and the fourth material layers can be second spacer materiallayers that provide vertical spacing between each vertically neighboringpair of the second insulating layers 232. In one embodiment, the thirdmaterial layers and the fourth material layers can be second insulatinglayers 232 and second sacrificial material layers 242, respectively. Thethird material of the second insulating layers 232 may be at least oneinsulating material. The fourth material of the second sacrificialmaterial layers 242 may be a sacrificial material that can be removedselective to the third material of the second insulating layers 232. Thesecond sacrificial material layers 242 may comprise an insulatingmaterial, a semiconductor material, or a conductive material. The fourthmaterial of the second sacrificial material layers 242 can besubsequently replaced with electrically conductive electrodes which canfunction, for example, as control gate electrodes of a vertical NANDdevice.

In one embodiment, each second insulating layer 232 can include a secondinsulating material, and each second sacrificial material layer 242 caninclude a second sacrificial material. In this case, the second stack(232, 242) can include an alternating plurality of second insulatinglayers 232 and second sacrificial material layers 242. The thirdmaterial of the second insulating layers 232 can be deposited, forexample, by chemical vapor deposition (CVD). The fourth material of thesecond sacrificial material layers 242 can be formed, for example, CVDor atomic layer deposition (ALD).

The third material of the second insulating layers 232 can be at leastone insulating material. Insulating materials that can be used for thesecond insulating layers 232 can be any material that can be used forthe first insulating layers 132. The fourth material of the secondsacrificial material layers 242 is a sacrificial material that can beremoved selective to the third material of the second insulating layers232. Sacrificial materials that can be used for the second sacrificialmaterial layers 242 can be any material that can be used for the firstsacrificial material layers 142. In one embodiment, the secondinsulating material can be the same as the first insulating material,and the second sacrificial material can be the same as the firstsacrificial material.

The thicknesses of the second insulating layers 232 and the secondsacrificial material layers 242 can be in a range from 20 nm to 50 nm,although lesser and greater thicknesses can be used for each secondinsulating layer 232 and for each second sacrificial material layer 242.The number of repetitions of the pairs of a second insulating layer 232and a second sacrificial material layer 242 can be in a range from 2 to1,024, and typically from 8 to 256, although a greater number ofrepetitions can also be used. In one embodiment, each second sacrificialmaterial layer 242 in the second stack (232, 242) can have a uniformthickness that is substantially invariant within each respective secondsacrificial material layer 242.

Second stepped surfaces in the second stepped area can be formed in theword line contact via region 200 using a same set of processing steps asthe processing steps used to form the first stepped surfaces in thefirst stepped area with suitable adjustment to the pattern of at leastone masking layer. A second-tier retro-stepped dielectric materialportion 265 can be formed over the second stepped surfaces in the wordline contact via region 200.

A second insulating cap layer 270 can be subsequently formed over thesecond alternating stack (232, 242). The second insulating cap layer 270includes a dielectric material that is different from the material ofthe second sacrificial material layers 242. In one embodiment, thesecond insulating cap layer 270 can include silicon oxide. In oneembodiment, the first and second sacrificial material layers (142, 242)can comprise silicon nitride.

Generally speaking, at least one alternating stack of insulating layers(132, 232) and spacer material layers (such as sacrificial materiallayers (142, 242)) can be formed over the planar semiconductor materiallayer 10, and at least one retro-stepped dielectric material portion(165, 265) can be formed over the staircase regions on the at least onealternating stack (132, 142, 232, 242).

Optionally, drain-select-level shallow trench isolation structures 72can be formed through a subset of layers in an upper portion of thesecond-tier alternating stack (232, 242). The second sacrificialmaterial layers 242 that are cut by the select-drain-level shallowtrench isolation structures 72 correspond to the levels in whichdrain-select-level electrically conductive layers are subsequentlyformed. The drain-select-level shallow trench isolation structures 72include a dielectric material such as silicon oxide.

Referring to FIGS. 7A and 7B, second-tier memory openings 249 and secondtier support openings 219 extending through the second-tier structure(232, 242, 270, 265) are formed in areas overlying the sacrificialmemory opening fill portions 148. A photoresist layer can be appliedover the second-tier structure (232, 242, 270, 265), and can belithographically patterned to form a same pattern as the pattern of thesacrificial memory opening fill portions 148 and the sacrificial supportopening fill portions 118, i.e., the pattern of the first-tier memoryopenings 149 and the first-tier support openings 119. Thus, thelithographic mask used to pattern the first-tier memory openings 149 andthe first-tier support openings 119 can be used to pattern thesecond-tier memory openings 249 and the second-tier support openings219. An anisotropic etch can be performed to transfer the pattern of thelithographically patterned photoresist layer through the second-tierstructure (232, 242, 270, 265). In one embodiment, the chemistry of theanisotropic etch process used to etch through the materials of thesecond-tier alternating stack (232, 242) can alternate to optimizeetching of the alternating material layers in the second-tieralternating stack (232, 242). The anisotropic etch can be, for example,a series of reactive ion etches. The patterned lithographic materialstack can be removed, for example, by ashing after the anisotropic etchprocess.

A top surface of an underlying sacrificial memory opening fill portion148 can be physically exposed at the bottom of each second-tier memoryopening 249. A top surface of an underlying sacrificial support openingfill portion 118 can be physically exposed at the bottom of eachsecond-tier support opening 219. After the top surfaces of thesacrificial memory opening fill portions 148 and the sacrificial supportopening fill portions 118 are physically exposed, an etch process can beperformed, which removes the sacrificial material of the sacrificialmemory opening fill portions 148 and the sacrificial support openingfill portions 118 selective to the materials of the second-tieralternating stack (232, 242) and the first-tier alternating stack (132,142) (e.g., C₄F₈/O₂/Ar etch).

Upon removal of the sacrificial memory opening fill portions 148, eachvertically adjoining pair of a second-tier memory opening 249 and afirst-tier memory opening 149 forms a continuous cavity that extendsthrough the first-tier alternating stack (132, 142) and the second-tieralternating stack (232, 242). Likewise, upon removal of the sacrificialsupport opening fill portions 118, each vertically adjoining pair of asecond-tier support opening 219 and a first-tier support opening 119forms a continuous cavity that extends through the first-tieralternating stack (132, 142) and the second-tier alternating stack (232,242). The continuous cavities are herein referred to as memory openings(or inter-tier memory openings) and support openings (or inter-tiersupport openings), respectively. A top surface of the planarsemiconductor material layer 10 can be physically exposed at the bottomof each memory opening and at the bottom of each support openings.Locations of steps S in the first-tier alternating stack (132, 142) andthe second-tier alternating stack (232, 242) are illustrated as dottedlines.

Referring to FIG. 8 , memory opening fill structures 58 are formedwithin each memory opening, and support pillar structures 20 are formedwithin each support opening. The memory opening fill structures 58 andthe support pillar structures 20 can include a same set of components,and can be formed simultaneously.

FIGS. 9A-9H provide sequential cross-sectional views of a memory opening49 or a support opening (119, 219) during formation of a memory openingfill structure 58 or a support pillar structure 20. While a structuralchange in a memory opening 49 is illustrated in FIGS. 9A-9H, it isunderstood that the same structural change occurs in each memoryopenings 49 and in each of the support openings (119, 219) during thesame set of processing steps.

Referring to FIG. 9A, a memory opening 49 in the exemplary devicestructure of FIG. 14 is illustrated. The memory opening 49 extendsthrough the first-tier structure and the second-tier structure.Likewise, each support opening (119, 219) extends through the first-tierstructure and the second-tier structure.

Referring to FIG. 9B, an optional pedestal channel portion (e.g., anepitaxial pedestal) 11 can be formed at the bottom portion of eachmemory opening 49 and each support openings (119, 219), for example, bya selective semiconductor deposition process. In one embodiment, thepedestal channel portion 11 can be doped with electrical dopants of thesame conductivity type as the planar semiconductor material layer 10. Inone embodiment, at least one source select gate electrode can besubsequently formed by replacing each sacrificial material layer (142,242) located below the horizontal plane including the top surfaces ofthe pedestal channel portions 11 with a respective conductive materiallayer. A cavity 49′ is present in the unfilled portion of the memoryopening 49 (or of the support opening) above the pedestal channelportion 11. In one embodiment, the pedestal channel portion 11 cancomprise single crystalline silicon. In one embodiment, the pedestalchannel portion 11 can have a doping of the same as the conductivitytype of the planar semiconductor material layer 10.

Referring to FIG. 9C, a stack of layers including a blocking dielectriclayer 52, a charge storage layer 54, a tunneling dielectric layer 56,and an optional first semiconductor channel layer 601 can besequentially deposited in the memory openings 49.

The blocking dielectric layer 52 can include a single dielectricmaterial layer or a stack of a plurality of dielectric material layers.In one embodiment, the blocking dielectric layer can include adielectric metal oxide layer consisting essentially of a dielectricmetal oxide. As used herein, a dielectric metal oxide refers to adielectric material that includes at least one metallic element and atleast oxygen. The dielectric metal oxide may consist essentially of theat least one metallic element and oxygen, or may consist essentially ofthe at least one metallic element, oxygen, and at least one non-metallicelement such as nitrogen. In one embodiment, the blocking dielectriclayer 52 can include a dielectric metal oxide having a dielectricconstant greater than 7.9, i.e., having a dielectric constant greaterthan the dielectric constant of silicon nitride.

Non-limiting examples of dielectric metal oxides include aluminum oxide(Al₂O₃), hafnium oxide (HfO₂), lanthanum oxide (LaO₂), yttrium oxide(Y₂O₃), tantalum oxide (Ta₂O₅), silicates thereof, nitrogen-dopedcompounds thereof, alloys thereof, and stacks thereof. The dielectricmetal oxide layer can be deposited, for example, by chemical vapordeposition (CVD), atomic layer deposition (ALD), pulsed laser deposition(PLD), liquid source misted chemical deposition, or a combinationthereof. The thickness of the dielectric metal oxide layer can be in arange from 1 nm to 20 nm, although lesser and greater thicknesses canalso be used. The dielectric metal oxide layer can subsequently functionas a dielectric material portion that blocks leakage of storedelectrical charges to control gate electrodes. In one embodiment, theblocking dielectric layer 52 includes aluminum oxide. In one embodiment,the blocking dielectric layer 52 can include multiple dielectric metaloxide layers having different material compositions.

Alternatively or additionally, the blocking dielectric layer 52 caninclude a dielectric semiconductor compound such as silicon oxide,silicon oxynitride, silicon nitride, or a combination thereof. In oneembodiment, the blocking dielectric layer 52 can include silicon oxide.In this case, the dielectric semiconductor compound of the blockingdielectric layer 52 can be formed by a conformal deposition method suchas low pressure chemical vapor deposition, atomic layer deposition, or acombination thereof. The thickness of the dielectric semiconductorcompound can be in a range from 1 nm to 20 nm, although lesser andgreater thicknesses can also be used. Alternatively, the blockingdielectric layer 52 can be omitted, and a backside blocking dielectriclayer can be formed after formation of backside recesses on surfaces ofmemory films to be subsequently formed.

Subsequently, the charge storage layer 54 can be formed. In oneembodiment, the charge storage layer 54 can be a continuous layer orpatterned discrete portions of a charge trapping material including adielectric charge trapping material, which can be, for example, siliconnitride. Alternatively, the charge storage layer 54 can include acontinuous layer or patterned discrete portions of a conductive materialsuch as doped polysilicon or a metallic material that is patterned intomultiple electrically isolated portions (e.g., floating gates), forexample, by being formed within lateral recesses into sacrificialmaterial layers (142, 242). In one embodiment, the charge storage layer54 includes a silicon nitride layer. In one embodiment, the sacrificialmaterial layers (142, 242) and the insulating layers (132, 232) can havevertically coincident sidewalls, and the charge storage layer 54 can beformed as a single continuous layer.

In another embodiment, the sacrificial material layers (142, 242) can belaterally recessed with respect to the sidewalls of the insulatinglayers (132, 232), and a combination of a deposition process and ananisotropic etch process can be used to form the charge storage layer 54as a plurality of memory material portions that are vertically spacedapart. While the present disclosure is described using an embodiment inwhich the charge storage layer 54 is a single continuous layer, in otherembodiments the charge storage layer 54 is replaced with a plurality ofmemory material portions (which can be charge trapping material portionsor electrically isolated conductive material portions) that arevertically spaced apart.

The charge storage layer 54 can be formed as a single charge storagelayer of homogeneous composition, or can include a stack of multiplecharge storage layers. The multiple charge storage layers, if used, cancomprise a plurality of spaced-apart floating gate material layers thatcontain conductive materials (e.g., metal such as tungsten, molybdenum,tantalum, titanium, platinum, ruthenium, and alloys thereof, or a metalsilicide such as tungsten silicide, molybdenum silicide, tantalumsilicide, titanium silicide, nickel silicide, cobalt silicide, or acombination thereof) and/or semiconductor materials (e.g.,polycrystalline or amorphous semiconductor material including at leastone elemental semiconductor element or at least one compoundsemiconductor material). Alternatively or additionally, the chargestorage layer 54 may comprise an insulating charge trapping material,such as one or more silicon nitride segments. Alternatively, the chargestorage layer 54 may comprise conductive nanoparticles such as metalnanoparticles, which can be, for example, ruthenium nanoparticles. Thecharge storage layer 54 can be formed, for example, by chemical vapordeposition (CVD), atomic layer deposition (ALD), physical vapordeposition (PVD), or any suitable deposition technique for storingelectrical charges therein. The thickness of the charge storage layer 54can be in a range from 2 nm to 20 nm, although lesser and greaterthicknesses can also be used.

The tunneling dielectric layer 56 includes a dielectric material throughwhich charge tunneling can be performed under suitable electrical biasconditions. The charge tunneling may be performed through hot-carrierinjection or by Fowler-Nordheim tunneling induced charge transferdepending on the mode of operation of the monolithic three-dimensionalNAND string memory device to be formed. The tunneling dielectric layer56 can include silicon oxide, silicon nitride, silicon oxynitride,dielectric metal oxides (such as aluminum oxide and hafnium oxide),dielectric metal oxynitride, dielectric metal silicates, alloys thereof,and/or combinations thereof. In one embodiment, the tunneling dielectriclayer 56 can include a stack of a first silicon oxide layer, a siliconoxynitride layer, and a second silicon oxide layer, which is commonlyknown as an ONO stack. In one embodiment, the tunneling dielectric layer56 can include a silicon oxide layer that is substantially free ofcarbon or a silicon oxynitride layer that is substantially free ofcarbon. The thickness of the tunneling dielectric layer 56 can be in arange from 2 nm to 20 nm, although lesser and greater thicknesses canalso be used.

The optional first semiconductor channel layer 601 includes asemiconductor material such as at least one elemental semiconductormaterial, at least one III-V compound semiconductor material, at leastone II-VI compound semiconductor material, at least one organicsemiconductor material, or other semiconductor materials known in theart. In one embodiment, the first semiconductor channel layer 601includes amorphous silicon or polysilicon. The first semiconductorchannel layer 601 can be formed by a conformal deposition method such aslow pressure chemical vapor deposition (LPCVD). The thickness of thefirst semiconductor channel layer 601 can be in a range from 2 nm to 10nm, although lesser and greater thicknesses can also be used. A cavity49′ is formed in the volume of each memory opening 49 that is not filledwith the deposited material layers (52, 54, 56, 601).

Referring to FIG. 9D, the optional first semiconductor channel layer601, the tunneling dielectric layer 56, the charge storage layer 54, theblocking dielectric layer 52 are sequentially anisotropically etchedusing at least one anisotropic etch process. The portions of the firstsemiconductor channel layer 601, the tunneling dielectric layer 56, thecharge storage layer 54, and the blocking dielectric layer 52 locatedabove the top surface of the second insulating cap layer 270 can beremoved by the at least one anisotropic etch process. Further, thehorizontal portions of the first semiconductor channel layer 601, thetunneling dielectric layer 56, the charge storage layer 54, and theblocking dielectric layer 52 at a bottom of each cavity 49′ can beremoved to form openings in remaining portions thereof. Each of thefirst semiconductor channel layer 601, the tunneling dielectric layer56, the charge storage layer 54, and the blocking dielectric layer 52can be etched by a respective anisotropic etch process using arespective etch chemistry, which may, or may not, be the same for thevarious material layers.

Each remaining portion of the first semiconductor channel layer 601 canhave a tubular configuration. The charge storage layer 54 can comprise acharge trapping material or a floating gate material. In one embodiment,each charge storage layer 54 can include a vertical stack of chargestorage regions that store electrical charges upon programming. In oneembodiment, the charge storage layer 54 can be a charge storage layer inwhich each portion adjacent to the sacrificial material layers (142,242) constitutes a charge storage region.

A surface of the pedestal channel portion 11 (or a surface of the planarsemiconductor material layer 10 in case the pedestal channel portions 11are not used) can be physically exposed underneath the opening throughthe first semiconductor channel layer 601, the tunneling dielectriclayer 56, the charge storage layer 54, and the blocking dielectric layer52. Optionally, the physically exposed semiconductor surface at thebottom of each cavity 49′ can be vertically recessed so that therecessed semiconductor surface underneath the cavity 49′ is verticallyoffset from the topmost surface of the pedestal channel portion 11 (orof the semiconductor material layer 10 in case pedestal channel portions11 are not used) by a recess distance. A tunneling dielectric layer 56is located over the charge storage layer 54. A set of a blockingdielectric layer 52, a charge storage layer 54, and a tunnelingdielectric layer 56 in a memory opening 49 constitutes a memory film 50,which includes a plurality of charge storage regions (comprising thecharge storage layer 54) that are insulated from surrounding materialsby the blocking dielectric layer 52 and the tunneling dielectric layer56. In one embodiment, the first semiconductor channel layer 601, thetunneling dielectric layer 56, the charge storage layer 54, and theblocking dielectric layer 52 can have vertically coincident sidewalls.

Referring to FIG. 9E, a second semiconductor channel layer 602 can bedeposited directly on the semiconductor surface of the pedestal channelportion 11 or the semiconductor material layer 10 if the pedestalchannel portion 11 is omitted, and directly on the first semiconductorchannel layer 601. The second semiconductor channel layer 602 includes asemiconductor material such as at least one elemental semiconductormaterial, at least one III-V compound semiconductor material, at leastone II-VI compound semiconductor material, at least one organicsemiconductor material, or other semiconductor materials known in theart. In one embodiment, the second semiconductor channel layer 602includes amorphous silicon or polysilicon. The second semiconductorchannel layer 602 can be formed by a conformal deposition method such aslow pressure chemical vapor deposition (LPCVD). The thickness of thesecond semiconductor channel layer 602 can be in a range from 2 nm to 10nm, although lesser and greater thicknesses can also be used. The secondsemiconductor channel layer 602 may partially fill the cavity 49′ ineach memory opening, or may fully fill the cavity in each memoryopening.

The materials of the first semiconductor channel layer 601 and thesecond semiconductor channel layer 602 are collectively referred to as asemiconductor channel material. In other words, the semiconductorchannel material is a set of all semiconductor material in the firstsemiconductor channel layer 601 and the second semiconductor channellayer 602.

Referring to FIG. 9F, in case the cavity 49′ in each memory opening isnot completely filled by the second semiconductor channel layer 602, adielectric core layer 62L can be deposited in the cavity 49′ to fill anyremaining portion of the cavity 49′ within each memory opening. Thedielectric core layer 62L includes a dielectric material such as siliconoxide or organosilicate glass. The dielectric core layer 62L can bedeposited by a conformal deposition method such as low pressure chemicalvapor deposition (LPCVD), or by a self-planarizing deposition processsuch as spin coating.

Referring to FIG. 9G, the horizontal portion of the dielectric corelayer 62L can be removed, for example, by a recess etch from above thetop surface of the second insulating cap layer 270. Each remainingportion of the dielectric core layer 62L constitutes a dielectric core62. Further, the horizontal portion of the second semiconductor channellayer 602 located above the top surface of the second insulating caplayer 270 can be removed by a planarization process, which can use arecess etch or chemical mechanical planarization (CMP). Each remainingportion of the second semiconductor channel layer 602 can be locatedentirety within a memory opening 49 or entirely within a support opening(119, 219).

Each adjoining pair of a first semiconductor channel layer 601 and asecond semiconductor channel layer 602 can collectively form a verticalsemiconductor channel 60 through which electrical current can flow whena vertical NAND device including the vertical semiconductor channel 60is turned on. A tunneling dielectric layer 56 is surrounded by a chargestorage layer 54, and laterally surrounds a portion of the verticalsemiconductor channel 60. Each adjoining set of a blocking dielectriclayer 52, a charge storage layer 54, and a tunneling dielectric layer 56collectively constitute a memory film 50, which can store electricalcharges with a macroscopic retention time. In some embodiments, ablocking dielectric layer 52 may not be present in the memory film 50 atthis step, and a blocking dielectric layer may be subsequently formedafter formation of backside recesses. As used herein, a macroscopicretention time refers to a retention time suitable for operation of amemory device as a permanent memory device such as a retention time inexcess of 24 hours.

Referring to FIG. 9H, the top surface of each dielectric core 62 can befurther recessed within each memory opening, for example, by a recessetch to a depth that is located between the top surface of the secondinsulating cap layer 270 and the bottom surface of the second insulatingcap layer 270. Drain regions 63 can be formed by depositing a dopedsemiconductor material within each recessed region above the dielectriccores 62. The drain regions 63 can have a doping of a secondconductivity type that is the opposite of the first conductivity type.For example, if the first conductivity type is p-type, the secondconductivity type is n-type, and vice versa. The dopant concentration inthe drain regions 63 can be in a range from 5.0×10¹⁹/cm³ to2.0×10²¹/cm³, although lesser and greater dopant concentrations can alsobe used. The doped semiconductor material can be, for example, dopedpolysilicon. Excess portions of the deposited semiconductor material canbe removed from above the top surface of the second insulating cap layer270, for example, by chemical mechanical planarization (CMP) or a recessetch to form the drain regions 63.

Each combination of a memory film 50 and a vertical semiconductorchannel 60 (which is a vertical semiconductor channel) within a memoryopening 49 constitutes a memory stack structure 55. The memory stackstructure 55 is a combination of a semiconductor channel, a tunnelingdielectric layer, a plurality of memory elements comprising portions ofthe charge storage layer 54, and an optional blocking dielectric layer52. Each combination of a pedestal channel portion 11 (if present), amemory stack structure 55, a dielectric core 62, and a drain region 63within a memory opening 49 constitutes a memory opening fill structure58. Each combination of a pedestal channel portion 11 (if present), amemory film 50, a vertical semiconductor channel 60, a dielectric core62, and a drain region 63 within each support opening (119, 219) fillsthe respective support openings (119, 219), and constitutes a supportpillar structure 20.

The first-tier structure (132, 142, 170, 165), the second-tier structure(232, 242, 270, 265), the inter-tier dielectric layer 180, the memoryopening fill structures 58, and the support pillar structures 20collectively constitute a memory-level assembly. The memory-levelassembly is formed over the planar semiconductor material layer 10 suchthat the planar semiconductor material layer 10 includes horizontalsemiconductor channels electrically connected to vertical semiconductorchannels 60 within the memory stack structures 55.

Referring to FIGS. 10A and 10B, a first contact level dielectric layer280 can be formed over the memory-level assembly. The first contactlevel dielectric layer 280 is formed at a contact level through whichvarious contact via structures are subsequently formed to the drainregions 63 and the various electrically conductive layers that replacesthe sacrificial material layers (142, 242) in subsequent processingsteps.

First through-stack via cavities 585 can be formed with the memory arrayregion 100, for example, by applying and patterning of a photoresistlayer to form openings therein, and by anisotropically etching theportions of the first contact level dielectric layer 280, thealternating stacks (132, 146, 232, 246), and the at least one seconddielectric material layer 768 that underlie the openings in thephotoresist layer. In one embodiment, each of the first through-stackvia cavities 585 can be formed within a respective three-dimensionalmemory array so that each first through-stack via cavities 585 islaterally surrounded by memory opening fill structures 58. In oneembodiment, one or more of the first through-stack via cavities 585 canbe formed through the drain-select-level shallow trench isolationstructures 72, as shown in FIG. 10B. However, other locations may alsobe selected. In one embodiment, the first-through-stack via cavities 585can be formed within areas of openings in the planar semiconductormaterial layer 10 and the optional planar conductive material layer 6.The bottom surface of each first through-stack via cavity 585 can beformed at, or above, the silicon nitride layer 766. In one embodiment,the silicon nitride layer 766 can be used as an etch stop layer duringthe anisotropic etch process that forms the first through-stack viacavities. In this case, the bottom surface of each first through-stackvia cavity 585 can be formed at the silicon nitride layer 766, and thesilicon nitride layer 766 can be physically exposed at the bottom ofeach first through-stack via cavity 585.

Referring to FIG. 11 , a dielectric material is deposited in the firstthrough-stack via cavities 585. The dielectric material can include asilicon-oxide based material such as undoped silicate glass, dopedsilicate glass, or a flowable oxide material. The dielectric materialcan be deposited by a conformal deposition method such as chemical vapordeposition or spin coating. A void may be formed within an unfilledportion of each first through-stack via cavity 585. Excess portion ofthe deposited dielectric material may be removed from above a horizontalplane including the top surface of the first contact level dielectriclayer 280, for example, by chemical mechanical planarization or a recessetch. Each remaining dielectric material portion filling a respectiveone of the first through-stack via cavity 585 constitutes athrough-stack insulating material portion 584. The through-stackinsulating material portions 584 contact sidewalls of the alternatingstacks (132, 146, 232, 246), and may contact the silicon nitride layer766.

Referring to FIGS. 12A and 12B, backside contact trenches 79 aresubsequently formed through the first contact level dielectric layer 280and the memory-level assembly. For example, a photoresist layer can beapplied and lithographically patterned over the first contact leveldielectric layer 280 to form elongated openings that extend along afirst horizontal direction hd1. An anisotropic etch is performed totransfer the pattern in the patterned photoresist layer through thefirst contact level dielectric layer 280 and the memory-level assemblyto a top surface of the planar semiconductor material layer 10. Thephotoresist layer can be subsequently removed, for example, by ashing.

The backside contact trenches 79 extend along the first horizontaldirection hd1, and thus, are elongated along the first horizontaldirection hd1. The backside contact trenches 79 can be laterally spacedone from another along a second horizontal direction hd2, which can beperpendicular to the first horizontal direction hd1. The backsidecontact trenches 79 can extend through the memory array region (e.g., amemory plane) 100 and the word line contact via region 200. The firstsubset of the backside contact trenches 79 laterally divides thememory-level assembly (e.g., into memory blocks).

Referring to FIGS. 13A and 13B, an etchant that selectively etches thematerials of the first and second sacrificial material layers (142, 242)with respect to the materials of the first and second insulating layers(132, 232), the first and second insulating cap layers (170, 270), andthe material of the outermost layer of the memory films 50 can beintroduced into the backside contact trenches 79, for example, using anisotropic etch process. First backside recesses are formed in volumesfrom which the first sacrificial material layers 142 are removed. Secondbackside recesses are formed in volumes from which the secondsacrificial material layers 242 are removed. In one embodiment, thefirst and second sacrificial material layers (142, 242) can includesilicon nitride, and the materials of the first and second insulatinglayers (132, 232), can be silicon oxide. In another embodiment, thefirst and second sacrificial material layers (142, 242) can include asemiconductor material such as germanium or a silicon-germanium alloy,and the materials of the first and second insulating layers (132, 232)can be selected from silicon oxide and silicon nitride.

The isotropic etch process can be a wet etch process using a wet etchsolution, or can be a gas phase (dry) etch process in which the etchantis introduced in a vapor phase into the backside contact trench 79. Forexample, if the first and second sacrificial material layers (142, 242)include silicon nitride, the etch process can be a wet etch process inwhich the first exemplary structure is immersed within a wet etch tankincluding phosphoric acid, which etches silicon nitride selective tosilicon oxide, silicon, and various other materials used in the art. Incase the sacrificial material layers (142, 242) comprise a semiconductormaterial, a wet etch process (which may use a wet etchant such as a KOHsolution) or a dry etch process (which may include gas phase HCl) may beused.

Each of the first and second backside recesses can be a laterallyextending cavity having a lateral dimension that is greater than thevertical extent of the cavity. In other words, the lateral dimension ofeach of the first and second backside recesses can be greater than theheight of the respective backside recess. A plurality of first backsiderecesses can be formed in the volumes from which the material of thefirst sacrificial material layers 142 is removed. A plurality of secondbackside recesses can be formed in the volumes from which the materialof the second sacrificial material layers 242 is removed. Each of thefirst and second backside recesses can extend substantially parallel tothe top surface of the substrate 8. A backside recess can be verticallybounded by a top surface of an underlying insulating layer (132 or 232)and a bottom surface of an overlying insulating layer (132 or 232). Inone embodiment, each of the first and second backside recesses can havea uniform height throughout.

In one embodiment, a sidewall surface of each pedestal channel portion11 can be physically exposed at each bottommost first backside recessafter removal of the first and second sacrificial material layers (142,242). Further, a top surface of the planar semiconductor material layer10 can be physically exposed at the bottom of each backside contacttrench 79. An annular dielectric spacer (not shown) can be formed aroundeach pedestal channel portion 11 by oxidation of a physically exposedperipheral portion of the pedestal channel portions 11. Further, asemiconductor oxide portion (not shown) can be formed from eachphysically exposed surface portion of the planar semiconductor materiallayer 10 concurrently with formation of the annular dielectric spacers.

A backside blocking dielectric layer (not shown) can be optionallydeposited in the backside recesses and the backside contact trenches 79and over the first contact level dielectric layer 280. The backsideblocking dielectric layer can be deposited on the physically exposedportions of the outer surfaces of the memory stack structures 55. Thebackside blocking dielectric layer includes a dielectric material suchas a dielectric metal oxide, silicon oxide, or a combination thereof. Ifused, the backside blocking dielectric layer can be formed by aconformal deposition process such as atomic layer deposition or chemicalvapor deposition. The thickness of the backside blocking dielectriclayer can be in a range from 1 nm to 60 nm, although lesser and greaterthicknesses can also be used.

At least one conductive material can be deposited in the plurality ofbackside recesses, on the sidewalls of the backside contact trench 79,and over the first contact level dielectric layer 280. The at least oneconductive material can include at least one metallic material, i.e., anelectrically conductive material that includes at least one metallicelement.

A plurality of first electrically conductive layers 146 can be formed inthe plurality of first backside recesses, a plurality of secondelectrically conductive layers 246 can be formed in the plurality ofsecond backside recesses, and a continuous metallic material layer (notshown) can be formed on the sidewalls of each backside contact trench 79and over the first contact level dielectric layer 280. Thus, the firstand second sacrificial material layers (142, 242) can be replaced withthe first and second conductive material layers (146, 246),respectively. Specifically, each first sacrificial material layer 142can be replaced with an optional portion of the backside blockingdielectric layer and a first electrically conductive layer 146, and eachsecond sacrificial material layer 242 can be replaced with an optionalportion of the backside blocking dielectric layer and a secondelectrically conductive layer 246. A backside cavity is present in theportion of each backside contact trench 79 that is not filled with thecontinuous metallic material layer.

The metallic material can be deposited by a conformal deposition method,which can be, for example, chemical vapor deposition (CVD), atomic layerdeposition (ALD), electroless plating, electroplating, or a combinationthereof. The metallic material can be an elemental metal, anintermetallic alloy of at least two elemental metals, a conductivenitride of at least one elemental metal, a conductive metal oxide, aconductive doped semiconductor material, a conductivemetal-semiconductor alloy such as a metal silicide, alloys thereof, andcombinations or stacks thereof. Non-limiting exemplary metallicmaterials that can be deposited in the backside recesses includetungsten, tungsten nitride, titanium, titanium nitride, tantalum,tantalum nitride, cobalt, and ruthenium. In one embodiment, the metallicmaterial can comprise a metal such as tungsten and/or metal nitride. Inone embodiment, the metallic material for filling the backside recessescan be a combination of titanium nitride layer and a tungsten fillmaterial. In one embodiment, the metallic material can be deposited bychemical vapor deposition or atomic layer deposition.

Residual conductive material can be removed from inside the backsidecontact trenches 79. Specifically, the deposited metallic material ofthe continuous metallic material layer can be etched back from thesidewalls of each backside contact trench 79 and from above the firstcontact level dielectric layer 280, for example, by an anisotropic orisotropic etch. Each remaining portion of the deposited metallicmaterial in the first backside recesses constitutes a first electricallyconductive layer 146. Each remaining portion of the deposited metallicmaterial in the second backside recesses constitutes a secondelectrically conductive layer 246. Each electrically conductive layer(146, 246) can be a conductive line structure.

A subset of the second electrically conductive layers 246 located at thelevels of the drain-select-level shallow trench isolation structures 72constitutes drain select gate electrodes. A subset of the firstelectrically conductive layers 146 located at each level of the annulardielectric spacers (not shown) constitutes source select gateelectrodes. A subset of the electrically conductive layer (146, 246)located between the drain select gate electrodes and the source selectgate electrodes can function as combinations of a control gate and aword line located at the same level. The control gate electrodes withineach electrically conductive layer (146, 246) are the control gateelectrodes for a vertical memory device including the memory stackstructure 55.

Each of the memory stack structures 55 comprises a vertical stack ofmemory elements located at each level of the electrically conductivelayers (146, 246). A subset of the electrically conductive layers (146,246) can comprise word lines for the memory elements. The semiconductordevices in the underlying peripheral device region 700 can comprise wordline switch devices configured to control a bias voltage to respectiveword lines. The memory-level assembly is located over the substratesemiconductor layer 9. The memory-level assembly includes at least onealternating stack (132, 146, 232, 246) and memory stack structures 55vertically extending through the at least one alternating stack (132,146, 232, 246). Each of the at least one an alternating stack (132, 146,232, 246) includes alternating layers of respective insulating layers(132 or 232) and respective electrically conductive layers (146 or 246).The at least one alternating stack (132, 146, 232, 246) comprisesstaircase regions that include terraces in which each underlyingelectrically conductive layer (146, 246) extends farther along the firsthorizontal direction hd1 than any overlying electrically conductivelayer (146, 246) in the memory-level assembly.

Dopants of a second conductivity type, which is the opposite of thefirst conductivity type of the planar semiconductor material layer 10,can be implanted into a surface portion of the planar semiconductormaterial layer 10 to form a source region 61 underneath the bottomsurface of each backside contact trench 79. An insulating spacer 74including a dielectric material can be formed at the periphery of eachbackside contact trench 79, for example, by deposition of a conformalinsulating material (such as silicon oxide) and a subsequent anisotropicetch. The first contact level dielectric layer 280 may be thinned due toa collateral etch during the anisotropic etch that removes the verticalportions of horizontal portions of the deposited conformal insulatingmaterial. A horizontal semiconductor channel 59 can be provided betweeneach source region 61 and a neighboring group of pedestal channelportion 11.

A conformal insulating material layer can be deposited in the backsidecontact trenches 79, and can be anisotropically etched to forminsulating spacers 74. The insulating spacers 74 include an insulatingmaterial such as silicon oxide, silicon nitride, and/or a dielectricmetal oxide. A cavity laterally extending along the first horizontaldirection hd1 is present within each insulating spacer 74.

A backside contact via structure can be formed in the remaining volumeof each backside contact trench 79, for example, by deposition of atleast one conductive material and removal of excess portions of thedeposited at least one conductive material from above a horizontal planeincluding the top surface of the first contact level dielectric layer280 by a planarization process such as chemical mechanical planarizationor a recess etch. The backside contact via structures are electricallyinsulated in all lateral directions, and is laterally elongated alongthe first horizontal direction hd1. As such, the backside contact viastructures are herein referred to as laterally-elongated contact viastructures 76. As used herein, a structure is “laterally elongated” ifthe maximum lateral dimension of the structure along a first horizontaldirection is greater than the maximum lateral dimension of the structurealong a second horizontal direction that is perpendicular to the firsthorizontal direction at least by a factor of 5.

Optionally, each laterally-elongated contact via structure 76 mayinclude multiple backside contact via portions such as a lower backsidecontact via portion and an upper backside contact via portion. In anillustrative example, the lower backside contact via portion can includea doped semiconductor material (such as doped polysilicon), and can beformed by depositing the doped semiconductor material layer to fill thebackside contact trenches 79 and removing the deposited dopedsemiconductor material from upper portions of the backside contacttrenches 79. The upper backside contact via portion can include at leastone metallic material (such as a combination of a TiN liner and a W fillmaterial), and can be formed by depositing the at least one metallicmaterial above the lower backside contact via portions, and removing anexcess portion of the at least one metallic material from above thehorizontal plane including the top surface of the first contact leveldielectric layer 280. The first contact level dielectric layer 280 canbe thinned and removed during a latter part of the planarizationprocess, which may use chemical mechanical planarization (CMP), a recessetch, or a combination thereof. Each laterally-elongated contact viastructure 76 can be formed through the memory-level assembly and on arespective source region 61. The top surface of each laterally-elongatedcontact via structure 76 can located above a horizontal plane includingthe top surfaces of the memory stack structures 55.

Referring to FIGS. 14A and 14B, a second contact level dielectric layer282 can be optionally formed over the first contact level dielectriclayer 280. The second contact level dielectric layer 282 includes adielectric material such as silicon oxide or silicon nitride. Thethickness of the second contact level dielectric layer 282 can be in arange from 30 nm to 300 nm, although lesser and greater thicknesses canalso be used.

Drain contact via structures 88 contacting the drain regions 63 canextend through the contact level dielectric layers (280, 282) and thesecond insulating cap layer 270 in the memory array region 100. A sourceconnection via structure 91 can extend through the contact leveldielectric layers (280, 282) to provide electrical connection to thelaterally-elongated contact via structures 76.

Various contact via structures can be formed through the contact leveldielectric layers (280, 282) and the retro-stepped dielectric materialportions (165, 265). For example, word line contact via structures 86can be formed in the word line contact region 200. A subset of the wordline contact via structures 86 contacting the second electricallyconductive layers 246 extends through the second-tier retro-steppeddielectric material portion 265 in the word line contact region 200, anddoes not extend through the first-tier retro-stepped dielectric materialportion 165. Another subset of the word line contact via structures 86contacting the first electrically conductive layers 146 extends throughthe second-tier retro-stepped dielectric material portion 265 andthrough the first-tier retro-stepped dielectric material portion 165 inthe word line contact region 200.

Referring to FIG. 15 , a photoresist layer is applied over the secondcontact level dielectric layer 282, and is lithographically patterned toform openings that overlie the through-stack insulating materialportions 584 in the memory array region 100, and additional memoryopenings in which layers of the alternating stacks (132, 146, 232, 246)are absent, i.e., in a peripheral region 400 located outside the memoryarray region 100 and the contact region 200. For example, the peripheralregion may surround memory array region 100 and/or the contact region200 and/or may be located on one or more sides of the memory arrayregion 100 and/or the contact region 200. In one embodiment, the areasof the openings in the memory array region 100 may be entirely withinthe areas of the through-stack insulating material portions 584. In oneembodiment, the areas of the openings outside the areas of the memoryarray region 100 and the contact region 200 (e.g., the areas of theopenings in the peripheral region 400) may be within areas of openingsin the planar semiconductor material layer 10 and the optional planarconductive material layer 6.

Via cavities (487, 587) are formed by an anisotropic etch process thattransfers the pattern of the openings in the photoresist layer to thetop surfaces of the topmost lower metal line structures 788.Specifically, second through-stack via cavities 587 are formed throughthe through-stack insulating material portions 584 such that a remainingportion of each through-stack insulating material portion 584 afterformation of the second through-stack via cavities 587 constitutes athrough-stack insulating spacer 586. In one embodiment, the secondthrough-stack via cavities 587 can be formed using an anisotropic etchprocess that includes a first etch step that etches the dielectricmaterial of the through-stack insulating material portions 584 selectiveto silicon nitride, and a second etch step that etches a physicallyexposed portion of the silicon nitride layer 766. The first etch stepuses the silicon nitride layer 766 as an etch stop layer. Thus, the viacavities 587 are etched through the insulating material (e.g., siliconoxide) of the through-stack insulating material portions 584, ratherthan through the electrically conductive layers (e.g., tungsten and/ortitanium nitride layers) (146, 246). Etching silicon oxide of portions584 is easier than etching refractory metal and/or refractory metalnitride layers (146, 246). Furthermore, etching the opening 585 throughthe alternating stack of insulating layers (132, 232) such as siliconoxide, and sacrificial material layers (142, 242) such as siliconnitride before forming the electrically conductive layers (146, 246)easier than etching the opening through the electrically conductivelayers (146, 246). Thus, by forming and filling the openings 585 with aninsulating material (e.g., with portions 584) before replacing thesacrificial material layers with the electrically conductive layersmakes it easier to subsequently form the second through-stack viacavities 587 through the insulating material after replacing thesacrificial material layers with the electrically conductive layers,instead of etching the cavities 587 through the electrically conductivelayers.

Each through-stack insulating spacer 586 can have a substantiallycylindrical shape. Depending on the lithographic alignment of thepattern of the openings in the photoresist layer and the through-stackinsulating material portions 584, the second through-stack via cavities587 may, or may not, have a lateral offset from the geometrical centerof a respective one of the through-stack insulating material portion584. Thus, the through-stack insulating spacers 586 may, or may not,have a uniform thickness around the vertical axis passing through thegeometrical center thereof as a function of an azimuthal angle. In otherwords, the through-stack insulating spacers 586 may have the samethickness irrespective of the azimuthal angle in the case of perfectlithographic alignment, or may have an azimuthally-varying thicknessthat is measured between the inner sidewall and the outer sidewall of arespective through-stack insulating spacer 586. The second through-stackvia cavities 587 are formed through the silicon nitride layer 766. A topsurface of a lower metal line structure (such as a topmost lower metalliner structure 788) can be physically exposed at the bottom of eachsecond through-stack via cavity 587.

Further, through-dielectric via cavities 487 can be formed in theperipheral region through the contact level dielectric layers (280,282), the retro-stepped dielectric material portions (165, 265), the atleast one second dielectric material layer 768, and the silicon nitridelayer 766 to a top surface of a respective one of the topmost lowermetal liner structures 788. The through-dielectric via cavities 487 canbe formed concurrently with formation of the second through-stack viacavities 587 using a same photolithography and anisotropic etchprocesses. In one embodiment, the through-dielectric via cavities 487can pass through openings in the planar semiconductor material layer 10and the optional planar conductive material layer 6. The photoresistlayer can be removed, for example, by ashing.

Referring to FIGS. 16A and 16B, at least one conductive material can besimultaneously deposited in the second through-stack via cavities 587and the through-dielectric via cavities 487. The at least one conductivematerial can include, for example, a metallic nitride liner (such as aTiN liner) and a metal fill material (such as W, Cu, Al, Ru, or Co).Excess portions of the at least one conductive material can be removedfrom outside the second through-stack via cavities 587 and thethrough-dielectric via cavities 487. For example, excess portions of theat least one conductive material can be removed from above the topsurface of the second contact level dielectric layer 282 by aplanarization process such as chemical mechanical planarization and/or arecess etch. Each remaining portion of the at least one conductivematerial in the second through-stack via cavities 587 constitutes athrough-stack contact via structure 588 that contacts a top surface of arespective one of the topmost lower metal line structure 788. Eachremaining portion of the at least one conductive material in thethrough-dielectric via cavities 487 that contacts a top surface of arespective one of the topmost lower metal line structure 788 constitutesa through-dielectric contact via structure 488. Each through-stackcontact via structure 588 can be formed within a respective secondthrough-stack via cavity 587 and inside a respective through-stackinsulating spacer 586. Thus, through-stack contact via structures 588are formed through the alternating stacks (132, 146, 232, 246), the atleast one second dielectric material layer 768, and the silicon nitridelayer 766, and directly on a top surface of a lower metal line structure(such as a topmost lower metal line structure 788). In this embodiment,each through-stack contact via structure 588 extends through the secondcontact level dielectric layer 282 and the silicon nitride layer (i.e.,the hydrogen barrier layer) 766, while the respective through-stackinsulating spacer 586 does not extend through the second contact leveldielectric layer 282 and the silicon nitride layer (i.e., the hydrogenbarrier layer) 766.

Referring to FIG. 17 , at least one upper interconnect level dielectriclayer 284 can be formed over the contact level dielectric layers (280,282). Various upper interconnect level metal structures can be formed inthe at least one upper interconnect level dielectric layer 284. Forexample, the various upper interconnect level metal structures caninclude line level metal interconnect structures (96, 98, 99). The linelevel metal interconnect structures (96, 98, 99) can include first uppermetal line structures 99 that contact a top surfaces of a respective oneof the through-stack contact via structures 588, second upper metal linestructures 96 that contact a top surface of a respective one of thethrough-dielectric contact via structures 488, and bit lines 98 thatcontact a respective one of the drain contact via structures 88 andextend along the second horizontal direction (e.g., bit line direction)hd2 and perpendicular to the first horizontal direction (e.g., word linedirection) hd1. In one embodiment, a subset of the first upper metalline structures 99 may be used to provide electrical connections throughthe source connection via structures 91 described above to thelaterally-elongated contact via structures 76 and to the source regions61. In one embodiment, a subset of the second upper metal linestructures 96 may contact, or are electrically coupled to, a respectivepair of a word line contact via structure 86 and a through-dielectriccontact via structure 488.

At least a subset of the upper metal interconnect structures (whichinclude the line level metal interconnect structures (96, 98, 99)) isformed over the three-dimensional memory array. The upper metalinterconnect structures comprise an upper metal line structure (such asa first upper metal line structure 99) that is formed directly on athrough-stack contact via structure 588. A set of conductive structuresincluding the through-stack contact via structure 588 and a lower metalline structure (such as a topmost lower metal line structure 788)provides an electrically conductive path between the at least onesemiconductor device 710 on the substrate semiconductor layer and theupper metal line structure. A through-dielectric contact via structure488 can be provided through the retro-stepped dielectric materialportions (165, 265), the at least one second dielectric material layer768, and the silicon nitride layer 766 and directly on a top surface ofanother lower metal line structure (e.g., another topmost lower metalline structure 788) of the lower metal interconnect structures 780.

In one embodiment, the semiconductor structure further comprises: aterrace region including stepped surfaces of layers of the alternatingstack (132, 232, 146, 246); a retro-stepped dielectric material portion(165 or 265) overlying the stepped surfaces and located at levels of thealternating stack (132, 232, 146, 246) and above the at least one seconddielectric material layer 768; and a through-dielectric contact viastructure 488 vertically extending through the retro-stepped dielectricmaterial portion (165 or 265), the at least one second dielectricmaterial layer 768, and the silicon nitride layer 766 and contacting atop surface of another lower metal line structure 788 of the lower metalinterconnect structures 780. In one embodiment, a through-stack contactvia structure 588 is laterally spaced from each layer within thealternating stack (132, 232, 146, 246) by a through-stack insulatingspacer 586. Alternatively, the through-dielectric contact via structure488 directly contacts the retro-stepped dielectric material portion (165or 265) and the at least one second dielectric material layer 768 (asillustrated in FIG. 17 ).

In one embodiment, the memory stack structures 55 can comprise memoryelements of a vertical NAND device. The electrically conductive layers(146, 246) can comprise, or can be electrically connected to, arespective word line of the vertical NAND device. The substrate 8 cancomprises a silicon substrate. The vertical NAND device can comprise anarray of monolithic three-dimensional NAND strings over the siliconsubstrate. At least one memory cell in a first device level of the arrayof monolithic three-dimensional NAND strings is located over anothermemory cell in a second device level of the array of monolithicthree-dimensional NAND strings. The silicon substrate can contain anintegrated circuit comprising the word line driver circuit and a bitline driver circuit for the memory device. The array of monolithicthree-dimensional NAND strings can comprise a plurality of semiconductorchannels, wherein at least one end portion (such as a verticalsemiconductor channel 60) of each of the plurality of semiconductorchannels (59, 11, 60) extends substantially perpendicular to a topsurface of the semiconductor substrate 8, a plurality of charge storageelements (comprising portions of the memory material layer 54 located ateach word line level), each charge storage element located adjacent to arespective one of the plurality of semiconductor channels (59, 11, 60),and a plurality of control gate electrodes (comprising a subset of theelectrically conductive layers (146, 246) having a strip shape extendingsubstantially parallel to the top surface of the substrate 8 (e.g.,along the first horizontal direction hd1), the plurality of control gateelectrodes comprise at least a first control gate electrode located inthe first device level and a second control gate electrode located inthe second device level.

The first exemplary structure of FIG. 17 can be a memory and logic die1000, which can be subsequently bonded to a logic die usingcopper-to-copper bonding. Generally speaking, a memory and logic die1000 can include a three-dimensional memory device and peripheral logicdevices 710 located in the peripheral device region 700 used drivercircuit devices for the three-dimensional memory device. The peripherallogic devices 710 (i.e., driver circuit devices) can include word linedecoder circuitry, word line switching circuitry, bit line decodercircuitry, bit line sensing and/or switching circuitry, powersupply/distribution circuitry, data buffer and/or latch, or any othersemiconductor circuitry that can be implemented outside a memory arraystructure for a memory device. For example, the peripheral logic devices710 can include word line drivers that drive a respective one of theword lines (146, 246), bit line drivers that drive a respective one ofthe bit lines 98, and a sense amplifier circuitry electrically connectedto the bit lines 98 and configured to read a state of selected memoryelements within the three-dimensional array of memory elements.

The three-dimensional memory device includes a three-dimensional arrayof memory elements (such as portions of charge storage layers 54 in thememory film 50 located at levels of the electrically conductive layers(146, 246) and a vertical semiconductor channel 60). Thethree-dimensional memory device can include word lines comprising theelectrically conductive layers (146, 246) and bit lines 98 forindividually accessing the memory elements within the three-dimensionalarray of memory elements. The line level metal interconnect structures(96, 98, 99) may include interconnection bonding pads attached to, orintegrated into, one or more of the first upper metal line structures99, the second upper metal line structures 96, and the bit lines 98. Asused herein, an “interconnection bonding pad” refers to a bonding padthat can be used to form an electrical signal interconnection path whenbonded to a mating bonding pad. An interconnection bonding pad may be amemory-side bonding pad when the interconnection bonding pad is locatedon the side of a memory device and is configured to mate anotherinterconnection bonding pad connected to a peripheral logic device, ormay be a logic-side bonding pad when the interconnection pad is locatedon the side of a peripheral logic device and is configured to mateanother interconnection bonding pad connected to a memory device. Suchinterconnection bonding pads can be used to bond the memory and logicdie 1000 to a logic die including a matching set of interconnectionbonding pads. Alternatively, additional dielectric layers can be formedabove the line level interconnect structures (96, 98, 99), andinterconnection bonding pads can be included in such additionaldielectric layers and electrically connected to the line levelinterconnect structures (96, 98, 99) by additional electricallyconductive line and/or via structures.

The various semiconductor devices formed on the substrate 8 may beomitted in some embodiments. FIG. 18 illustrates an alternativeembodiment of the first exemplary structure during manufacture of amemory-only die 1000′, which does not include peripheral logic deviceson the top surface of the substrate 8, and includes a three-dimensionalmemory device including a three-dimensional array of memory elements. Asin the case of the first exemplary structure of FIG. 17 , the line levelmetal interconnect structures (96, 98, 99) may include interconnectionbonding pads attached to, or integrated into, one or more of the firstupper metal line structures 99, the second upper metal line structures96, and the bit lines 98. Alternatively, additional dielectric layerscan be formed above the line level interconnect structures (96, 98, 99),and interconnection bonding pads can be included in such additionaldielectric layers and electrically connected to the line levelinterconnect structures (96, 98, 99) by additional electricallyconductive line and/or via structures. Such interconnection bonding padscan be used to bond the memory-only die 1000′ to a logic die including amatching set of interconnection bonding pads. In one embodiment, theinterconnection bonding pads can include memory-side bonding pads. Theset of dielectric material layers embedding memory-side bonding pads iscollectively referred to as a memory dielectric material layer.Generally speaking, the memory dielectric material layer can be formedover, or under, the three-dimensional array of memory elements. Thememory-side bonding pads are included in the memory dielectric materiallayer, and are electrically connected to a respective node within thethree-dimensional memory device.

Referring to FIG. 19 , a second exemplary structure is illustrated,which includes a logic die 2000. The logic die 2000 includes aperipheral logic circuitry that includes complementary metal oxidesemiconductor (CMOS) devices 2710 containing PMOS and NMOS field effecttransistors located on a semiconductor substrate 2009. In oneembodiment, the semiconductor substrate 2009 can be a silicon wafer. TheCMOS devices can include active regions 2730, which include sourceregions and drain regions separated by respective channel regions 2746included within the semiconductor substrate 2009. The CMOS devices caninclude gate structures 2750, each of which includes a vertical stack ofa gate dielectric and a gate electrode. At least one dielectric materiallayer, which can be a plurality of dielectric material layers, is formedover the CMOS devices, which is herein referred to as a logic dielectricmaterial layer 2760. Metal interconnect structures 2780 (which areherein referred to as second metal interconnect structures) can beformed in the logic dielectric material layer 2760. The metalinterconnect structures 2780 can include metal via structures 2784 andmetal line structures 2786, each of which can be included in the logicdielectric material layer 2760 and in electrical contact with the activeregions 2730 or gate structures 2750 of the CMOS devices 2710. The logicdielectric material layer 2760 overlies the CMOS devices 2710 in anupright position, and underlies the CMOS devices 2710 in an upside-downposition.

Bonding pads (2792, 2794) can be formed in a surface portion of thelogic dielectric material layer 2760 such that the top surface of eachbonding pad (2792, 2794) is physically exposed at the top surface of thelogic dielectric material layer 2760. The bonding pads (2792, 2794) caninclude logic-side bonding pads 2792 and through-substrate via contactpads 2794. Each of the bonding pads (2792, 2794) is included in thelogic dielectric material layer 2760, and can be electrically connectedto a respective node (e.g., active regions 2730 or gate structures 2750)within the CMOS devices 2710 through the metal interconnect structures2780.

A three-dimensional memory device including a three-dimensional array ofmemory elements can be provided in a memory and logic die 1000 or in amemory-only die 1000′. The memory and logic dies 1000 and thememory-only dies 1000′ are collectively referred to as memory-containingdies (1000, 1000′). In one embodiment, the CMOS devices can include wordline drivers that drive a respective one of the word lines comprisingthe electrically conductive layers (146, 246) within a memory-containingdie (1000, 1000′), bit line drivers that can drive a respective one ofthe bit lines 98 located in the memory-containing die (1000, 1000′) uponsubsequent bonding of the logic die 2000 with the memory-containing die(1000, 1000′), and a sense amplifier circuitry electrically connected tothe bit lines 98 and configured to read a state of selected memoryelements within the three-dimensional array of memory elements uponsubsequent bonding of the logic die 2000 with the memory-containing die(1000, 1000′).

Referring to FIG. 20 , the backside of the logic die 2000 can beoptionally thinned. The thinning of the backside of the logic die 2000can be effected by grinding, etching, and/or polishing the backside ofthe semiconductor substrate 2009. The thickness of the semiconductorsubstrate 2009 after thinning can be in a range from 30 microns to 200microns, although lesser and greater thicknesses can also be used. Inone embodiment, a sacrificial protective material layer may be appliedover the top surface of the logic dielectric material layer 2760 duringthinning and subsequently removed.

Referring to FIG. 21 , memory-side bonding pads 1792 can be provided onany of the memory-containing dies (1000, 1000′) described above. Asdiscussed above, the memory-side bonding pads 1792 can be integratedinto the line level metal interconnect structures (96, 98, 99), or maybe formed above the line level metal interconnect structures (96, 98,99) at a different level and electrically connected to the line levelmetal interconnect structures (96, 98, 99). Generally, a memorydielectric material layer 1760 is formed above a three-dimensional arrayof memory elements. The memory dielectric material layer 1760 caninclude contact level dielectric layers (280, 282) and at least oneupper interconnect level dielectric layer 284 as shown in FIGS. 17 and18 , and any additional dielectric material layer formed thereabove.

Memory-side metal interconnect structures 1780 (which are hereinreferred to first metal interconnect structures) formed in the memorydielectric material layer 1760 can include line level metal interconnectstructures (96, 98, 99) and various contact via structures (86, 88, 586,488), and may include additional line level structures and/or additionalvia level structures. The memory-side bonding pads 1792 can be formed onthe uppermost elements of the memory interconnect structures 1780. Topsurfaces of the memory-side bonding pads 1792 can be coplanar with thetop surface of the memory dielectric material layer 1760.

Generally, the pattern of the memory-side bonding pads 1792 and thepattern of the logic-side bonding pads 2792 can be selected such thatthe pattern of the memory-side bonding pads 1792 and the mirror image ofthe pattern of the logic-side bonding pads 2792 have an areal overlap ateach location at which electrical connection is to be made between amemory-side bonding pad 1792 and a logic-side bonding pad 2792 uponbonding. In some embodiments, the pattern of the memory-side bondingpads 1792 in the memory-containing die (1000, 1000′) may be the mirrorimage of the pattern of the logic-side bonding pads 2792 in the logicdie 2000.

The thickness of each memory-side bonding pad 1792 can be in a rangefrom 50 nm to 1,000 nm, such as from 100 nm to 500 nm, although lesserand greater thicknesses can also be used. The thickness of eachlogic-side bonding pad 2792 can be in a range from 50 nm to 1,000 nm,such as from 100 nm to 500 nm, although lesser and greater thicknessescan also be used. The memory-side bonding pads 1792 and the logic-sidebonding pads 2792 may have a circular horizontal cross-sectional shape,a rectangular horizontal cross-sectional shape, an elliptical horizontalcross-sectional shape, or any horizontal cross-sectional shape of aclosed generally curvilinear two-dimensional geometrical shape. Themaximum lateral dimensions of the first and second bonding pads (1792,2792) can be in a range from 2 microns to 60 microns, such as from 5microns to 20 microns, although lesser and greater maximum lateraldimensions can also be used.

Referring to FIG. 22 , the memory-only die 1000′ of FIG. 21 and thelogic die 2000 of FIG. 20 can be bonded using copper-to-copper bondingto provide a first exemplary bonded assembly (1000′, 2000). Thememory-only die 1000′ and the logic die 2000 can be positioned such thatmemory-side bonding pads 1792 face the logic-side bonding pads 2792.Optionally, argon plasma treatment can be performed on the surfaces ofthe memory-side bonding pads 1792 and the logic-side bonding pads 2792to clean the surfaces prior to bonding. The memory-side bonding pads1792 in the memory-only die 1000′ can be disposed directly on thelogic-side bonding pads 2792 in the logic die 2000. Copperinterdiffusion can be induced by annealing the memory-only die 1000′ andthe logic die 2000 while matching pairs of memory-side bonding pads 1792and logic-side bonding pads 2792 remain in physical contact. Multiplebonded pairs (1792, 2792) of a respective memory-side bonding pad 1792and a respective logic-side bonding pad 2792 can be formed at aninterface between the memory-only die 1000′ and the logic die 2000.

Optionally, the backside of the substrate 8 can be thinned after thebonding step. The thickness of the substrate 8 after thinning may be ina range from 30 microns to 100 microns, although lesser and greaterthicknesses can also be used.

The first exemplary bonded assembly includes a functionalthree-dimensional memory device located in the memory-only die 1000′that is electrically connected to a peripheral logic device in the logicdie 2000. As such, the first exemplary bonded assembly (1000′, 2000) isconfigured to provide control signals from the logic die 2000 to thememory-only die 1000′ through the multiple bonded pairs of pads (1792,2792), and to provide sense signals from the memory-only die 1000′ tothe logic die 2000 through the multiple bonded pairs of pads (1792,2792). The multiple bonded pairs (1792, 2792) of a respectivememory-side bonding pad 1792 and a respective logic-side bonding pad2792 can function as bidirectional signal flow channels for controlsignals and sense signals.

In one embodiment, the three-dimensional array of memory elements can belocated within a two-dimensional array of vertical NAND strings, andeach vertical NAND string in the array of vertical NAND strings caninclude charge storage elements controlled by word lines comprising theelectrically conductive layers (146, 246) and a vertical semiconductorchannel 60 of which an end portion is electrically connected to arespective bit line 98 through a drain region 63. A first subset of thememory-side bonding pads 1792 can be electrically connected to arespective bit line 98, and a second subset of the memory-side bondingpads 1792 can be electrically connected to a respective word line.

In one embodiment shown in FIG. 21 , the memory-only die 1000′ caninclude a semiconductor material layer 10 contacting an end of eachvertical semiconductor channel 60 of the vertical NAND strings, andmetal interconnect structures 780 that are vertically spaced from thesemiconductor material layer 10, and are more proximal to thesemiconductor material layer 10 than to the vertical semiconductorchannels 60. In this case, the metal interconnect structures 780 can beincluded in an interconnect level dielectric material layer 760 locatedon an opposite side of the semiconductor material layer 10 with respectto the memory dielectric material layer 1760. In other words, theinterconnect level dielectric material layer 760 can be locatedunderneath the semiconductor material layer 10 and the memory dielectricmaterial layer 1760 can be located above the semiconductor materiallayer 10, or vice versa. Thus, the semiconductor material layer 10 islocated between the interconnect level dielectric material layer 760 andthe memory dielectric material layer 1760.

In case field effect transistors are not formed on the substratesemiconductor layer 9, the substrate semiconductor layer 9 may bereplaced with any carrier substrate that may include a semiconductormaterial, a conductive material, or an insulating material. Such acarrier substrate merely needs to provide mechanical strength forsupporting the three-dimensional memory devices thereupon. In oneembodiment, the memory-only die 1000′ can include a carrier substrate inlieu of the substrate semiconductor layer 9, which can be located on theinterconnect level dielectric material layer 760. In one embodiment, thecarrier substrate does not include any field effect transistor thereinor directly thereupon. The vertical field effect transistors in thethree-dimensional memory device within the memory-only die 1000′ can bevertically spaced from the carrier substrate by the interconnect leveldielectric material layer 760.

Referring to FIG. 23 , at least one through-substrate via structure 2796can be formed through the semiconductor substrate 2009 and the logicdielectric material layer 2760, and directly on a backside surface of arespective one of the through-substrate via contact pads 2794. Abackside insulating layer (not shown) may be optionally formed on thebackside of the semiconductor substrate 8 as needed. At least onethrough-substrate via cavity can be formed through the optional backsideinsulating layer, the semiconductor substrate 2009, and the logicdielectric material layer 2760 by an anisotropic etch process using apatterned etch mask layer with suitable openings therein. An insulatingliner can be formed within each through-substrate via cavity byconformal deposition of an insulating liner layer and by an anisotropicetch that removes horizontal portions of the insulating liner layer. Atleast one conductive material can be deposited in each remaining volumeof the at least one through-substrate via cavity. Excess portions of theat least one conductive material can be removed from above the backsidesurface of the semiconductor substrate 2009 to provide athrough-substrate via structure 2796 within a respective insulatingliner. A bonding pad 2799 can be formed on the backside of thesemiconductor substrate 2009.

Generally, a through-substrate via contact pad 2794 can be formed in thelogic dielectric material layer 2760. The front surface of thethrough-substrate via contact pad 2794 can contact the memory-only die1000′ (for example, the top surface of the memory dielectric materiallayer 1760) upon bonding the first and the logic dies (1000′, 2000). Athrough-substrate via structure 2796 extending through the semiconductorsubstrate 2009 and the logic dielectric material layer 2760 of the logicdie 2000 can be formed directly on a backside surface of thethrough-substrate via contact pad 2796. A bonding pad 2799 can be formedon the backside of the semiconductor substrate 2009 and on thethrough-substrate via structure 2796.

In the structure illustrated in FIG. 23 , the memory-only die 1000′ is afirst die comprising a three-dimensional memory device including athree-dimensional array of memory elements, a first dielectric materiallayer (i.e., the memory dielectric material layer 1760) overlying (in anupright position), or underlying (in an upside-down position), thethree-dimensional array of memory elements, and first bonding pads(i.e., the memory-side bonding pads 1792) included in the firstdielectric material layer 1760 and electrically connected to arespective node within the three-dimensional memory device. The logicdie 2000 is a second die comprising a semiconductor substrate 2009, aperipheral logic circuitry that includes complementary metal oxidesemiconductor (CMOS) devices located on the semiconductor substrate2009, a second dielectric material layer (i.e., a logic dielectricmaterial layer 2760) overlying (in the upright position), or underlying(in the upside-down position), the CMOS devices, and second bonding pads(i.e., the logic-side bonding pads 2792) included in the seconddielectric material layer 2760 and electrically connected to arespective node within the CMOS devices. The first bonding pads 1792 arebonded with the second bonding pads 2792 through copper interdiffusionto provide multiple bonded pairs (1792, 2792) of a respective firstbonding pad 1792 and a respective second bonding pad 2792 at aninterface between the first die 1000′ and the second die 2000. Controlsignals flow from the second die 2000 to the first die 1000 through themultiple bonded pairs (1792, 2792), and sense signals flow from thefirst die 1000′ to the second die 2000 through the multiple bonded pairs(1792, 2792).

The gate structures 1750 of the CMOS devices 2710 are located betweenthe memory array region 100 of the memory-containing die (1000, 1000′)and the semiconductor substrate 2009 containing the active regions 2730separated by a channel 2746 of the logic die 2000. In other words, thegate electrodes 1754 of the CMOS devices 2710 of the logic die 2000 arelocated upside-down below the source, drain and channel regions (2730,2746) of the same CMOS devices 2710 with respect to the top of thesubstrate 8 of the memory-containing die (1000, 1000′).

Referring to FIG. 24 , an alternative embodiment of the first exemplarybonded assembly is illustrated, which can be formed by bonding a memoryand logic die 1000 including first exemplary structure of FIG. 17 asmodified by formation of memory-side bonding pads 1792 (formed, forexample, using the processing steps of FIG. 21 ) and the logic die 2000including the second exemplary structure of FIG. 20 . In this case,metal interconnect structures 780 can be included in an interconnectlevel dielectric material layer 760 located on an opposite side of thesemiconductor material layer 10 with respect to the memory dielectricmaterial layer 1760. Thus, the semiconductor material layer 10 islocated between the interconnect level dielectric material layer 760 andthe memory dielectric material layer 1760. The logic die 2000 includes asemiconductor substrate 2009. The memory and logic die 1000 can includean additional semiconductor substrate (which can include a substratesemiconductor layer 9) located on the interconnect level dielectricmaterial layer 760. An additional peripheral logic circuitry thatincludes additional CMOS devices can be located on the additionalsemiconductor substrate 8, and can be electrically coupled to at leastone node of the three-dimensional memory device located in the memoryand logic die 1000.

In this embodiment, the peripheral logic circuitry of the logic die 2000can include very low voltage (VLV) CMOS devices 2710, while theperipheral logic circuitry of the logic and memory-containing die 1000can include low voltage (LV) and high voltage (HV) CMOS devices 710located in the peripheral device region 700. The VLV CMOS devices 2710are configured to be operated at a lower voltage than the LV and HV CMOSdevices 710. In one embodiment, the gate dielectric 1752 of the VLV CMOSdevices 2710 can be thinner than the gate dielectric 752 of the LVand/or HV CMOS devices 710. The gate structures 750 of the LV and/or HVCMOS devices 710 are located between the memory array region 100 and thesemiconductor substrate 8 containing the active regions 742 separated bya channel 746. The gate structures 1750 of the VLV devices 2710 arelocated between the memory array region 100 and the semiconductorsubstrate 2009 containing the active regions 2730 separated by a channel2746 of the logic die 2000.

In the structure illustrated in FIG. 24 , the memory and logic die 1000is a first die comprising a three-dimensional memory device including athree-dimensional array of memory elements, a first dielectric materiallayer (i.e., the memory dielectric material layer 1760) overlying (in anupright position), or underlying (in an upside-down position), thethree-dimensional array of memory elements, and first bonding pads(i.e., the memory-side bonding pads 1792) included in the firstdielectric material layer 1760 and electrically connected to arespective node within the three-dimensional memory device. The logicdie 2000 is a second die comprising a semiconductor substrate 2009, aperipheral logic circuitry that includes complementary metal oxidesemiconductor (CMOS) devices located on the semiconductor substrate2009, a second dielectric material layer (i.e., a logic dielectricmaterial layer 2760) overlying (in the upright position), or underlying(in the upside-down position), the CMOS devices, and second bonding pads(i.e., the logic-side bonding pads 2792) included in the seconddielectric material layer 2760 and electrically connected to arespective node within the CMOS devices. The first bonding pads 1792 arebonded with the second bonding pads 2792 through copper interdiffusionto provide multiple bonded pairs (1792, 2792) of a respective firstbonding pad 1792 and a respective second bonding pad 2792 at aninterface between the first die 1000 and the second die 2000. Controlsignals flow from the second die 2000 to the first die 1000 through themultiple bonded pairs (1792, 2792), and sense signals flow from thefirst die 1000 to the second die 2000 through the multiple bonded pairs(1792, 2792).

Referring to FIG. 25 , at least one through-substrate via structure 2796can be formed through the semiconductor substrate 2009 and the logicdielectric material layer 2760, and directly on a backside surface of arespective one of the through-substrate via contact pads 2794. Abackside insulating layer (not shown) may be optionally formed on thebackside of the semiconductor substrate 8 as needed. At least onethrough-substrate via cavity can be formed through the optional backsideinsulating layer, the semiconductor substrate 2009, and the logicdielectric material layer 2760 by an anisotropic etch process using apatterned etch mask layer with suitable openings therein. An insulatingliner can be formed within each through-substrate via cavity byconformal deposition of an insulating liner layer and by an anisotropicetch that removes horizontal portions of the insulating liner layer. Atleast one conductive material can be deposited in each remaining volumeof the at least one through-substrate via cavity. Excess portions of theat least one conductive material can be removed from above the backsidesurface of the semiconductor substrate 2009 to provide athrough-substrate via structure 2796 within a respective insulatingliner. A bonding pad 2799 can be formed on the backside of thesemiconductor substrate 2009. The bonding pads 2799 can be used to formpackaging bond structures, which may include C4 bonding structures orwire bonding structures for placement of the first exemplary structureinto a package such as a ceramic package or a laminated package.

Referring to FIG. 26 , a memory-only die 3000 and a memory and logic die1000 are illustrated prior to bonding. The memory-only die 3000 may bederived from the memory-only die 1000′ illustrated in FIG. 18 byincluding memory-side bonding pads 1792 at the level of the lower metalinterconnect structures 780. In this case, any carrier substrate may beused in lieu of the substrate semiconductor layer 9 of FIG. 18 . Thecarrier substrate may be subsequently removed from below the lower leveldielectric layers 760. For example, a silicon substrate using a thinhydrogen-implanted layer or sacrificial bonding layer near a top surfacemay be used as the carrier substrate, and bottom portion of the siliconsubstrate may be cleaved off during an anneal process after formation ofthe memory-only die 1000′. A remaining thin layer of silicon and bottomportions of the lower level dielectric layers 760 can be subsequentlyremoved by a planarization process, which can use a wet etch processand/or chemical mechanical planarization. For example, the thin layer ofsilicon can be etched by a wet etch process using a KOH solution, andthe bottom portions of the lower level dielectric layers 760 can beremoved by a wet etch using hot phosphoric acid and/or hydrofluoricacid. A touch-up chemical mechanical planarization process can be usedto physically expose the bottom surfaces of the memory-side bonding pads1792 that are present at the level of the lower metal interconnectstructures 780. The remaining portions of the lower level dielectriclayer 760 constitutes a memory dielectric material layer 3760, in whichthe memory-side bonding pads 1792 are included. An upper portion of thememory-only die 3000 can include an interconnect dielectric materiallayer 1860 embedding memory-side metal interconnect structures 1780 andbonding pads 1892. The bonding pads 1892 may be subsequently used tobond another die (not illustrated) to the memory-only die 3000.Alternatively, the bonding pads 1892 can be used to form packaging bondstructures, which may include C4 bonding structures or wire bondingstructures for placement of the second exemplary structure into apackage such as a ceramic package or a laminated package.

The memory and logic die 1000 of FIG. 26 may include the same elementsas the memory and logic die 1000 of FIG. 24 except that the dielectricmaterial at a top portion of the memory and logic die 1000 are used as alogic dielectric material layer 2760 and the bonding pads includedtherein are used as logic-side bonding pads 2792 (since the logic andmemory-containing die 1000 contains the peripheral logic devices 710 inregion 700). The logic-side bonding pads 2792 can be arranged to matchthe mirror image of the memory-side bonding pads 1792 in the memory-onlydie 3000.

Referring to FIG. 27 , the memory-only die 3000 and the memory and logicdie 1000 can be bonded using copper-to-copper bonding to provide asecond exemplary bonded assembly (3000, 1000). The memory-only die 3000and the memory and logic die 1000 can be positioned such thatmemory-side bonding pads 1792 face the logic-side bonding pads 2792.Optionally, argon plasma treatment can be performed on the surfaces ofthe memory-side bonding pads 1792 and the logic-side bonding pads 2792to clean the surfaces prior to bonding. The memory-side bonding pads1792 in the memory-only die 3000 can be disposed directly on thelogic-side bonding pads 2792 in the memory and logic die 1000. Copperinterdiffusion can be induced by annealing the memory-only die 3000 andthe memory and logic die 1000 while matching pairs of memory-sidebonding pads 1792 and logic-side bonding pads 2792 remain in physicalcontact. Multiple bonded pairs (1792, 2792) of a respective memory-sidebonding pad 1792 and a respective logic-side bonding pad 2792 can beformed at an interface between the memory-only die 3000 and the memoryand logic die 1000.

The second exemplary bonded assembly includes a functionalthree-dimensional memory device located in the memory-only die 3000 thatis electrically connected to a peripheral logic device in the logic andlogic die 1000. As such, the second exemplary bonded assembly (3000,1000) is configured to provide control signals from the memory and logicdie 1000 to the memory-only die 3000 through the multiple bonded pairs(1792, 2792), and to provide sense signals from the memory-only die 3000to the memory and logic die 1000 through the multiple bonded pairs(1792, 2792). The multiple bonded pairs (1792, 2792) of a respectivememory-side bonding pad 1792 and a respective logic-side bonding pad2792 can function as bidirectional signal flow channels for controlsignals and sense signals.

In one embodiment, the three-dimensional array of memory elements can belocated within a two-dimensional array of vertical NAND strings, andeach vertical NAND string in the array of vertical NAND strings caninclude charge storage elements controlled by word lines comprising theelectrically conductive layers (146, 246) and a vertical semiconductorchannel 60 of which an end portion is connected to a respective bit line98. A first subset of the memory-side bonding pads 1792 can beelectrically connected to a respective bit line 98, and a second subsetof the memory-side bonding pads 1792 can be electrically connected to arespective word line.

In the second exemplary bonded assembly, the memory-only die 3000 is afirst die comprising a three-dimensional memory device including athree-dimensional array of memory elements, a first dielectric materiallayer (i.e., the memory dielectric material layer 3760) overlying (in anupside-down position), or underlying (in an upright position), thethree-dimensional array of memory elements, and first bonding pads(i.e., the memory-side bonding pads 1792) included in the firstdielectric material layer 3760 and electrically connected to arespective node within the three-dimensional memory device. The memoryand logic die 1000 is a second die comprising a semiconductor substrate8, a peripheral logic circuitry that includes complementary metal oxidesemiconductor (CMOS) devices 710 located on the semiconductor substrate8, a second dielectric material layer (i.e., a logic dielectric materiallayer 2760) overlying (in the upright position), or underlying (in theupside-down position), the CMOS devices, and second bonding pads (i.e.,the logic-side bonding pads 2792) included in the second dielectricmaterial layer 2760 and electrically connected to a respective nodewithin the CMOS devices. The first bonding pads 1792 are bonded with thesecond bonding pads 2792 through copper interdiffusion to providemultiple bonded pairs (1792, 2792) of a respective first bonding pad1792 and a respective second bonding pad 2792 at an interface betweenthe first die 3000 and the second die 2000. Control signals flow fromthe second die 2000 to the first die 3000 through the multiple bondedpairs (1792, 2792), and sense signals flow from the first die 3000 tothe second die 2000 through the multiple bonded pairs (1792, 2792).

In one embodiment, the second die (i.e., the memory and logic chip 1000)further includes an additional three-dimensional memory device includinga three-dimensional array of additional memory elements. Thethree-dimensional array of additional memory elements is located withina two-dimensional array of additional vertical NAND strings. Theadditional vertical NAND strings comprise charge storage elements (suchas portions of the charge storage layers 54 located at levels of theelectrically conductive layers (146, 246)) controlled by additional wordlines and additional bit lines. The CMOS devices located on thesemiconductor substrate 8 include a driver circuit for the additionalword lines and a driver circuit for the additional bit lines in thememory and logic chip 1000, as well as the driver circuit for the wordlines and the driver circuit for the bit lines in the memory-only chip3000.

In some embodiment, the multiple bonded pairs (1792, 2792) of therespective first bonding pad 1792 and the respective second bonding pad2792 can include a first subset of the multiple bonded pairs (1792,2792) that provides electrical connection between a respective word linein the first die 3000 and a respective word line in the second die 1000,and a second subset of multiple bonded pairs (1792, 2792) that provideselectrical connection between a respective bit line 98 in the first die3000 and a respective bit line 98 in the second die 1000.

In one embodiment, the semiconductor material layer 10 in the first die3000 is more proximal to the interface between the first die 3000 andthe second die 1000 than the two-dimensional array of vertical NANDstrings in the first die 3000 is to the interface between the first die3000 and the second die 1000. The three-dimensional memory device in thefirst die comprises word line contact via structures 86 includingproximal end surfaces 86P that are proximal to the interface between thefirst die 3000 and the second die 1000 and distal end surfaces 86D thatare distal from the interface between the first die 3000 and the seconddie 1000. The distal end surfaces 86D of the word line contact viastructures 86 can be located within a same horizontal plane, and can beequidistant from the interface between the first die 3000 and the seconddie 1000.

Referring to FIG. 28 , an alternative embodiment of the second exemplarybonded assembly can be formed by modifying the memory-only die 3000illustrated in FIG. 27 to provide memory-side bonding pads 1792 and amemory dielectric material layer 1760 in lieu of the combination of theinterconnect dielectric material layer 1860 and the bonding pads 1892 atan upper portion of the memory-only die 3000. The bonding pads 1892 maybe subsequently used to bond another die (not illustrated) to thememory-only die 3000. A bottom portion of the memory-only die 3000 caninclude lower metal interconnect structures 780 included in a lowerlevel dielectric layer 760 as illustrated in FIG. 18 . As in the case ofthe memory-only die 3000, a carrier substrate and a bottom portion ofthe lower level dielectric layer 760 can be removed to physically exposesurfaces of the lower metal interconnect structures 780, which mayinclude bonding pads that can be used to form packaging bond structuressuch as C4 bonding structures or wire bonding structures for placementof the alternate embodiment of the second exemplary structure into apackage such as a ceramic package or a laminated package.

The memory-only die 3000 can be flipped upside down to face the memoryand logic die 1000. The memory-only die 3000 and the memory and logicdie 1000 can be bonded using copper-to-copper bonding to provide asecond exemplary bonded assembly (3000, 1000). The memory-only die 3000and the memory and logic die 1000 can be positioned such thatmemory-side bonding pads 1792 face the logic-side bonding pads 2792.Optionally, argon plasma treatment can be performed on the surfaces ofthe memory-side bonding pads 1792 and the logic-side bonding pads 2792to clean the surfaces prior to bonding. The memory-side bonding pads1792 in the memory-only die 3000 can be disposed directly on thelogic-side bonding pads 2792 in the memory and logic die 1000. Copperinterdiffusion can be induced by annealing the memory-only die 3000 andthe memory and logic die 1000 while matching pairs of memory-sidebonding pads 1792 and logic-side bonding pads 2792 remain in physicalcontact. Multiple bonded pairs (1792, 2792) of a respective memory-sidebonding pad 1792 and a respective logic-side bonding pad 2792 can beformed at an interface between the memory-only die 3000 and the memoryand logic die 1000.

The second exemplary bonded assembly includes a functionalthree-dimensional memory device located in the memory-only die 3000 thatis electrically connected to a peripheral logic device in the logic andlogic die 1000. As such, the second exemplary bonded assembly (3000,1000) is configured to provide control signals from the memory and logicdie 1000 to the memory-only die 3000 through the multiple bonded pairs(1792, 2792), and to provide sense signals from the memory-only die 3000to the memory and logic die 1000 through the multiple bonded pairs(1792, 2792). The multiple bonded pairs (1792, 2792) of a respectivememory-side bonding pad 1792 and a respective logic-side bonding pad2792 can function as bidirectional signal flow channels for controlsignals and sense signals.

In the configuration illustrated in FIG. 28 , the semiconductor materiallayer 10 in the first die (i.e., the memory-only die 3000) is moredistal from the interface between the first die 3000 and the second die(i.e., the memory and logic die 1000) than the two-dimensional array ofvertical NAND strings in the first die 3000 is from the interfacebetween the first die 3000 and the second die 1000. Thethree-dimensional memory device in the first die 3000 comprises wordline contact via structures 86 including proximal end surfaces 86P thatare proximal to the interface between the first die 3000 and the seconddie 1000 and distal end surfaces 86D that are distal from the interfacebetween the first die 3000 and the second die 1000. The proximal endsurfaces 86P of the word line contact via structures 86 can be locatedwithin a same horizontal plane, and can be equidistant from theinterface between the first die 3000 and the second die 1000.

Referring to FIG. 29 , a third exemplary bonded assembly (2000, 1000′,3000) is illustrated. In this case, the lower level dielectric layers760 in the memory-only die 1000′ of FIG. 21 can be modified to embedadditional logic-side bonding pads 4792 in lieu of, or in addition to,lower metal interconnect structures 780. The modified memory-only die1000′ is bonded with the logic die 2000 illustrated in FIG. 20 toprovide a first exemplary bonded assembly (2000, 1000′) illustrated inFIG. 23 with the modification of presence of logic-side bonding pads4792 in lieu of, or in addition to, lower metal interconnect structures780.

Specifically, the substrate semiconductor layer 9 in the first exemplarybonded assembly (2000, 1000′) of FIG. 23 can be removed to physicallyexpose a bottom surface of the lower level dielectric layers 760. Forexample, a silicon substrate using a thin hydrogen-implanted layer orsacrificial bonding layer near a top surface may be used as thesubstrate semiconductor layer 9, and bottom portion of the siliconsubstrate may be cleaved off during an anneal process before, or after,bonding the memory-only die 1000′ and the logic die 2000. A remainingthin layer of silicon and bottom portions of the lower level dielectriclayers 760 can be subsequently removed by a planarization process, whichcan use a wet etch process and/or chemical mechanical planarization. Forexample, the thin layer of silicon can be etched by a wet etch processusing a KOH solution, and the bottom portions of the lower leveldielectric layers 760 can be removed by a wet etch using hot phosphoricacid and/or hydrofluoric acid. A touch-up chemical mechanicalplanarization process can be used to physically expose the bottomsurfaces of the logic-side bonding pads 4792 that are present at thelevel of the lower metal interconnect structures 780. The remainingportions of the lower level dielectric layer 760 functions as a logicdielectric material layer embedding the logic-side bonding pads 4792.

A memory-only die 3000, which is a third die, is provided. Thememory-only die 3000 can be the same as the memory-only die 3000 of FIG.26 within the modification that the memory dielectric material layer3760 embeds memory-side bonding pads 5792 that are configured to matewith the logic-side bonding pads 4792 located in the memory-only die1000′.

The first exemplary bonded assembly (2000, 1000′) and the memory-onlydie 3000 can be bonded using copper-to-copper bonding to provide thethird exemplary bonded assembly (2000, 1000′, 3000). The first exemplarybonded assembly (2000, 1000′) and the memory-only die 3000 can bepositioned such that memory-side bonding pads 5792 face the logic-sidebonding pads 4792. Optionally, argon plasma treatment can be performedon the surfaces of the memory-side bonding pads 5792 and the logic-sidebonding pads 4792 to clean the surfaces prior to bonding. Thememory-side bonding pads 5792 in the first exemplary bonded assembly(2000, 1000′) can be disposed directly on the logic-side bonding pads4792 in the memory-only die 3000. Copper interdiffusion can be inducedby annealing the first exemplary bonded assembly (2000, 1000′) and thememory-only die 3000 while matching pairs of memory-side bonding pads5792 and logic-side bonding pads 4792 remain in physical contact.Multiple bonded pairs (5792, 4792) of a respective memory-side bondingpad 5792 and a respective logic-side bonding pad 4792 can be formed atan interface between the first exemplary bonded assembly (2000, 1000′)and the memory-only die 3000. The third exemplary bonded assembly (2000,1000′, 3000) of a first die 1000′, a second die 2000, and a third die3000 includes vertical interconnections provided by a first set ofbonded pairs (1792, 2792) of a respective memory-side bonding pad 1792and a respective logic-side bonding pad 2792 and a second set of bondedpairs (5792, 4792) of a respective memory-side bonding pad 5792 and arespective logic-side bonding pad 4792.

In the structure illustrated in FIG. 29 , the memory-only die 1000′ is afirst die comprising a three-dimensional memory device including athree-dimensional array of memory elements, a first dielectric materiallayer (i.e., the memory dielectric material layer 1760) overlying (in anupright position), or underlying (in an upside-down position), thethree-dimensional array of memory elements, and first bonding pads(i.e., the memory-side bonding pads 1792) included in the firstdielectric material layer 1760 and electrically connected to arespective node within the three-dimensional memory device. The logicdie 2000 is a second die comprising a semiconductor substrate 2009, aperipheral logic circuitry that includes complementary metal oxidesemiconductor (CMOS) devices located on the semiconductor substrate2009, a second dielectric material layer (i.e., a logic dielectricmaterial layer 2760) overlying (in the upright position), or underlying(in the upside-down position), the CMOS devices, and second bonding pads(i.e., the logic-side bonding pads 2792) included in the seconddielectric material layer 2760 and electrically connected to arespective node within the CMOS devices. The first bonding pads 1792 arebonded with the second bonding pads 2792 through copper interdiffusionto provide multiple bonded pairs (1792, 2792) of a respective firstbonding pad 1792 and a respective second bonding pad 2792 at aninterface between the first die 1000′ and the second die 2000. Controlsignals flow from the second die 2000 to the first die 1000 through themultiple bonded pairs (1792, 2792), and sense signals flow from thefirst die 1000′ to the second die 2000 through the multiple bonded pairs(1792, 2792).

The first die, i.e., the memory-only die 1000′, includes third bondingpads, i.e., the logic-side bonding pads 4792, located on an oppositeside of the first bonding pads, i.e., the memory-side bonding pads 1792,with respect to the semiconductor material layer 10 in the first die1000′. The third die, i.e., the memory-only die 3000, includes anadditional three-dimensional memory device including a three-dimensionalarray of additional memory elements and fourth bonding pads, i.e., thememory-side bonding pads 5792, connected to a respective node of theadditional three-dimensional memory device. The third bonding pads 4792are bonded with the fourth bonding pads 5792 through copperinterdiffusion to provide additional multiple bonded pairs (4792, 5792)of a respective third bonding pad 4792 and a respective fourth bondingpad 5792 at an interface between the first die 1000′ and the third die3000.

In one embodiment, the three-dimensional array of additional memoryelements is located within a two-dimensional array of additionalvertical NAND strings in the third die 3000, and each additionalvertical NAND string in the array of vertical NAND strings comprisesrespective charge storage elements controlled by additional word linesand a respective vertical semiconductor channel 60 of which an endportion is connected to one of additional bit lines 98 in the third die3000. The peripheral logic circuitry containing CMOS devices 710 locatedon the semiconductor substrate 2009 of the second die 2000 includes adriver circuit for the additional word lines and a driver circuit forthe additional bit lines 98 in the third die 3000.

FIGS. 30A-30F are sequential vertical cross-sectional views of anexemplary structure during bonding of two dies according to anembodiment of the present disclosure.

Referring to FIG. 30A, a first die or a first bonded assembly {1000,1000′, 3000, or (2000, 1000′)) including first bonding pads 1792, whichmay be memory-side bonding pads 1792, is provided. A second die or asecond bonded assembly (1000, 2000) including second bonding pads 2792,which may be logic-side bonding pads 2792, is provided.

Referring to FIG. 30B, the first die or the first bonded assembly {1000,1000′, 3000, or (2000, 1000′)) and the second die or the second bondedassembly (1000, 2000) can be positioned such that memory-side bondingpads 1792 face the logic-side bonding pads 2792.

Referring to FIG. 30C, after, or prior to, positioning the first die orthe first bonded assembly {1000, 1000′, 3000, or (2000, 1000′)) and thesecond die or the second bonded assembly (1000, 2000) to face eachother, argon plasma treatment can be performed on the surfaces of thememory-side bonding pads 1792 and the logic-side bonding pads 2792 toclean the physically exposed surfaces of the memory-side bonding pads1792 and the logic-side bonding pads 2792.

Referring to FIG. 30D, the memory-side bonding pads 1792 in the firstdie or the first bonded assembly {1000, 1000′, 3000, or (2000, 1000′))can be disposed directly on the logic-side bonding pads 2792 in thesecond die or the second bonded assembly (2000, 3000). Copperinterdiffusion can be induced by annealing the memory-only die 1000′ orthe memory and logic die 1000 in contact with the logic die 2000 whilematching pairs of memory-side bonding pads 1792 and logic-side bondingpads 2792 remain in physical contact. The temperature of the thermalanneal can be in a range from 250 degrees Celsius to 400 degreesCelsius, although lower and higher temperatures can also be used.Multiple bonded pairs (1792, 2792) of a respective memory-side bondingpad 1792 and a respective logic-side bonding pad 2792 can be formed atan interface between the first die or the first bonded assembly {1000,1000′, 3000, or (2000, 1000′)) and the second die or the second bondedassembly (2000, 3000).

Referring to FIG. 30E, one or both of the first die or the first bondedassembly {1000, 1000′, 3000, or (2000, 1000′)) and the second die or thesecond bonded assembly (1000, 2000) can be thinned as needed.

Referring to FIG. 30F, the processing steps of FIG. 23 or FIG. 25 can beperformed to form through-substrate via structures 2796 and bonding pads2799, which may include C4 bonding structures or wire bonding structuresfor placement of the second exemplary structure into a package such as aceramic package or a laminated package. Thus, the bonded assembly formedby the processing steps of FIGS. 30A-30F can be packaged within a singlesemiconductor package including a single set of lead frames using C4bonding methods or wire bonding methods.

FIGS. 31A-31D illustrate various configurations of areal overlap in abonded assembly of a first die or a first bonded assembly {1000, 1000′,3000, or (2000, 1000′)) and a second die or a second bonded assembly(1000, 2000) according to various embodiments of the present disclosure.The first die or the first bonded assembly {1000, 1000′, 3000, or (2000,1000′)) and the second die or the second bonded assembly (1000, 2000)may have substantially the same areas as illustrated in FIG. 31A, or mayhave different areas as illustrated in FIG. 31B. A single first die or asingle first bonded assembly {1000, 1000′, 3000, or (2000, 1000′)) canbe bonded to a single second die or a single second bonded assembly(1000, 2000) as illustrated in FIG. 31A or FIG. 31B. Alternatively, asingle first die or a single first bonded assembly {1000, 1000′, 3000,or (2000, 1000′)) can be bonded to multiple second dies or multiplesecond bonded assemblies (2000, 3000) as illustrated in FIG. 31C. Yetalternatively, multiple first dies or multiple first bonded assemblies{1000, 1000′, 3000, or (2000, 1000′)) can be bonded to a single seconddie or a single second bonded assembly (1000, 2000) as illustrated inFIG. 31D.

In an alternative embodiment, a separate bonding layer or direct die todie contact can be used instead of the bonding pad bonding to bond thedies into die assembly. Thus, the embodiment of the present disclosureare not limited to bonding pad to bonding pad diffusion bonding.

According to various embodiments of the present disclosure and referringto all drawings of the present disclosure, a semiconductor structure isprovided, which comprises: a first die (1000, 1000′, 3000) comprising athree-dimensional memory device including a three-dimensional array ofmemory elements, a first dielectric material layer (1760, 3760)overlying, or underlying, the three-dimensional array of memoryelements, and first bonding pads 1792 included in the first dielectricmaterial layer and electrically connected to a respective node withinthe three-dimensional memory device; and a second die 2000 comprising asemiconductor substrate 2009, a peripheral logic circuitry that includescomplementary metal oxide semiconductor (CMOS) devices located on thesemiconductor substrate 2009, a second dielectric material layer 2760overlying, or underlying, the CMOS devices 2710, and second bonding pads2792 included in the second dielectric material layer 2760 andelectrically connected to a respective node within the CMOS devices.

The first bonding pads 1792 are bonded with the second bonding pads 2792through copper interdiffusion to provide multiple bonded pairs (1792,2792) of a respective first bonding pad 1792 and a respective secondbonding pad 2792 at an interface between the first die (1000, 1000′,3000) and the second die 2000. Control signals flow from the second die2000 to the first die (1000, 1000′, 3000) through the multiple bondedpairs (1792, 2792). Sense signals flow from the first die (1000, 1000′,3000) to the second die 2000 through the multiple bonded pairs (1792,2792).

In one embodiment, the three-dimensional memory device comprises wordlines comprising the electrically conductive layers (146, 246) and bitlines 98 for individually accessing the memory elements within thethree-dimensional array of memory elements. The CMOS devices 710comprise word line drivers that drive a respective one of the wordlines, bit line drivers that drive a respective one of the bit lines 98,and a sense amplifier circuitry electrically connected to the bit lines98 and configured to read a state of selected memory elements within thethree-dimensional array of memory elements.

The semiconductor structure can further include: a through-substrate viastructure 2796 extending through the semiconductor substrate 2009 andthe second dielectric material layer 2009 of the second die 2000; athrough-substrate via contact pad 2794 included in the second dielectricmaterial layer 2760, contacting the through-substrate via structure2796, and having a horizontal surface within a plane of the interfacebetween the first die (1000, 1000′, 3000) and the second die 2000; and abonding pad 2799 located on the semiconductor substrate 2009 andcontacting the through-substrate via structure 2796.

According to an aspect of the present disclosure, a method of forming abonded assembly of a three-dimensional memory device is provided. Amemory-containing die (1000 or 1000′) including a three-dimensionalarray of memory elements is provided as described above. A memorydielectric material layer 1760 is formed on a first side of thethree-dimensional array of memory elements, which may comprise portionsof charge storage layers 54 located at the levels of the electricallyconductive layers (146, 246). Memory-side bonding pads 1792 are includedin the memory dielectric material layer 1760, and are electricallyconnected to a respective node within the three-dimensional memorydevice.

A logic die 2000 is provided, which includes a peripheral circuitry(comprising a subset of the CMOS devices 2710) configured to controloperation of the three-dimensional array of memory elements, logicdielectric material layers 2760 located on a first side of theperipheral circuitry, and logic-side bonding pads 2792 included in thelogic dielectric material layers 2760 and electrically connected to arespective node of the peripheral circuitry.

Referring to FIGS. 32 and 33 , an exemplary layout of a logic die 2000is illustrated. The logic die 2000 can be used as one of bonded dies ina bonded assembly {(1000′, 2000) or (1000, 2000)} of various embodimentsof the present disclosure.

Referring to FIG. 32 , the peripheral circuitry of the logic die 2000can include sense amplifier and bit line driver circuits located inareas labeled with “SA/BLS,” word line driver circuits located in areaslabeled with “XDL,” column direction logic control circuits located inareas labeled with “YLOG,” source power supply circuits (e.g., sourceline bias voltage supply circuits) and well (e.g., p-well in which thesource, drain and channel regions of peripheral circuitry transistorsare located) bias voltage supply circuits located in areas labeled with“CELSRC/CPWELL,” electrical connections from the source power supplycircuits located between SA/BLS in areas labeled with ‘Shunt,” word linedecoder circuits (e.g., word line control transistors and low voltagedecoders) located in areas labeled with “WLTR/LVDEC,” input/outputcontrol circuits located in areas labeled with “IO_PADS,” and othermiscellaneous circuits located in areas labeled with “MISC.” Bondingpads 2799 can be located within the areas of the input/output controlcircuits on the backside of the semiconductor substrate 2009 asillustrated in FIG. 29 .

FIG. 33 is a layout of a first magnified region M1 within the logic die2000 of FIG. 32 . Each sense amplifier and bit line driver circuitincludes sense amplifiers and bit line drivers located in differentareas. In one embodiment, the sense amplifiers can be interlaced withbit line drivers along a horizontal direction within the logic die 2000.In an illustrative layout, a pair of sense amplifiers configured beconnected to a pair of bit lines 98 in a memory-containing die (1000 or1000′) can be located within each area labeled with “2-SA,” and a set of8 bit line drivers can be located within each area labeled with “8-BLS.”A unit cell including a set of four pairs of sense amplifiers and a setof eight bit line drivers can be repeated along a horizontal directionwithin each sense amplifier and bit line driver circuit.

According to an aspect of the present disclosure, thelaterally-elongated contact via structures 76 (illustrated, for example,in FIG. 18 ) in the memory-containing die (1000 or 1000′) can be used ascomponents of a source line that distributes a source power supplyvoltage across the memory-containing die (1000 or 1000′). A subset ofthe memory-side metal interconnect structures 1780 located in the memorydielectric material layer 1760 and a subset of the memory-side bondingpads 1792 can be used to provide electrical connections within thememory-containing die (1000 or 1000′) that distributes the source powersupply voltage across the memory-containing die (1000 or 1000′).

Referring to FIGS. 34-39 , a first exemplary configuration of a secondmagnified region M2 within the first magnified region M1 of FIG. 33 isillustrated. FIG. 34 illustrates the overlay between first metal linestructures (884, 886) located at a first metal line level and firstmetal via structures (814, 816) located at a first metal via level thatoverlies the first metal line level. FIG. 35 illustrates the overlaybetween the first metal via structures (814, 816) located at the firstmetal via level and second metal line structures (824A, 824B, 826)located at a second metal line level that overlies the first metal vialevel. FIG. 36 illustrates the overlay between the second metal linestructures (824A, 824B, 826) located at the second metal line level andpad-connection-level via structures (834A, 834B, 836) located at a padconnection level that overlies the second metal line level. FIG. 37illustrates the overlay between the pad-connection-level via structures(834A, 834B, 836) located at the pad connection level and logic-sidebonding pads 2792 located at a metal pad level that overlies the padconnection level. FIG. 38 is a vertical cross-sectional view along thevertical cross-sectional plane X-X′ of FIGS. 34, 35, 36, and 37 of thesecond magnified region M2. FIG. 39 is a composite view illustrating asubset of metal interconnect structures in the second metal line level,the pad connection level, and the metal pad level.

Each of the first metal line structures (884, 886), the first metal viastructures (814, 816), the second metal line structures (824A, 824B,826), the pad-connection-level via structures (834A, 834B, 836), and thelogic-side bonding pads 2792 can be included in the logic dielectricmaterial layer 2760, which can include a stack of multiple dielectricmaterial sublayers that are component layers of the logic dielectricmaterial layer 2760.

The first metal line structures (884, 886) located at the first metalline level include first source-connection metal line structures 884that are electrically connected to output nodes of the source powersupply circuit in the peripheral circuitry of the logic die 2000, andfirst bit-line-connection metal line structures 886 that areelectrically connected to nodes of a sense amplifier and bit line drivercircuit, for example, through bit-line-connection contact via structures806. The bit-line-connection contact via structures 806 can beelectrically connected to gate electrodes, source regions, or drainregions of complementary metal oxide semiconductor (CMOS) transistors ina respective sense amplifier and bit line driver circuit.

The first metal via structures (814, 816) located at the first metal vialevel include first source-connection metal via structures 814 thatcontact a top surface of a respective one of the first source-connectionmetal line structures 884, and first bit-line-connection metal viastructures 816 that contact a top surface of a respective one of thefirst bit-line-connection metal line structures 886.

The second metal line structures (824A, 824B, 826) located at a secondmetal line level include line-level mesh structures 824A that mayoptionally contact a top surface of a respective subset of the firstsource-connection metal via structures 814, isolated source-connectionline-level structures 824B that contact a respective one of the firstsource-connection metal via structures 814, and secondbit-line-connection metal line structures 826 that contact a top surfaceof a respective one of the bit-line-connection metal via structures 816.As used herein, a “mesh structure” refers to a structure having ageneral shape of a mesh in which at least two sets oflaterally-extending segments that extend along different lateraldirections are intertwined to provide a network including a plurality ofopenings therein. The line-level mesh structures 824A and subsets of theisolated source-connection line-level structures 824B may alternatealong a horizontal direction of alternation of the sense amplifiers andsets of bit line drivers. In one embodiment, each line-level meshstructures 824A may contact a plurality of first source-connection metalvia structures 814.

The pad-connection-level via structures (834A, 834B, 836) located at thepad connection level include mesh-interconnection via structures 834Athat contact a top surface of a respective one of the line-level meshstructures 824A, second source-connection metal via structures 834B thatcontact a top surface of a respective one of the isolatedsource-connection line-level structures 824B, and secondbit-line-connection metal via structures 836 that contact a top surfaceof a respective one of the second bit-line-connection metal linestructures 826.

The logic-side bonding pads 2792 can include at least one pad-level meshstructure 2792A electrically connected to a source power supply circuitwithin the peripheral circuitry through a respective set of at least onesecond source-connection metal via structure 834B. Each pad-level meshstructure 2792A can be connected to a pair of line-level mesh structures824A through a respective set of mesh-interconnection via structures834A. Thus, each pad-level mesh structure 2792A can contact top surfacesof a subset of the mesh-interconnection via structures 834A and a subsetof the second source-connection metal via structures 834B. Each of theat least one pad-level mesh structure 2792A may include an array ofdiscrete openings therethrough. Further, the logic-side bonding pads2792 can comprise discrete logic-side bonding pads 2792B electricallyisolated one from another and from the at least one pad-level meshstructure 2792A. The discrete logic-side bonding pads 2792B can contacta top surface of a respective one of the second bit-line-connectionmetal line structures 826.

A memory-containing die (1000, 1000′) described above can be providedwith memory-side bonding pads 1792. The memory-side bonding pads 1792can be arranged such that each of the memory-side bonding pads 1792 canbond with a respective one of the at least one pad-level mesh structure2792A and the discrete logic-side bonding pads 2792B. The at least onepad-level mesh structure 2792A can be provided as a plurality ofpad-level mesh structures 2792A that are laterally spaced apart bygroups of discrete logic-side bonding pads 2792B. The logic-side bondingpads 2792 can be bonded to a respective one, or a respective subset, ofthe memory-side bonding pads 1792 using any of the methods describedabove. In one embodiment, each of the discrete logic-side bonding pads2792B can be bonded to a respective one of the memory-side bonding pads1792, and each of the at least one pad-level mesh structure 2792A can bebonded to a respective plurality of memory-side bonding pads 1792 thatare electrically connected to the laterally-elongated contact viastructure 76 that are configured to distribute the source power supplyvoltage that is provided by the source power supply circuits in theperipheral circuitry of the logic die 2000.

The line-level mesh structures 824A can be included within the logicdielectric material layers 2760, and can include a plurality of openingstherethrough. A subset of the pad-connection-level via structures (834A,834B, 836), such as the mesh-interconnection via structures 834A, cancontact a respective one of the at least one pad-level mesh structure2792A and a respective one of the line-level mesh structures 824A.Another subset of the pad-connection-level via structures (834A, 834B,836) such as the second bit-line-connection metal via structures 836 cancontact a respective one of the discrete logic-side bonding pads 2792B,and can be located at a same level as the mesh-interconnection viastructures 834A. A plurality of the second bit-line-connection metal viastructures 836 can be located between a neighboring pair of theline-level mesh structures 824A. In one embodiment, a plurality ofpad-level mesh structures 2792A can contact a respective subset of thepad-connection-level via structures (834A, 834B, 836), which can includea respective subset of the mesh-interconnection via structures 834A anda respective subset of the second source-connection metal via structures834B. Each of the plurality of pad-level mesh structures 2792A can beelectrically connected to each of the line-level mesh structures 824A toprovide a source power distribution network within the logic die 2000that spans the entire area of a memory array region within thememory-containing die (1000, 1000′) that is bonded to the logic die2000.

Referring to FIGS. 40-45 , a second exemplary configuration of a secondmagnified region M2 within the first magnified region M1 of FIG. 33 isillustrated. FIG. 40 illustrates the overlay between first metal linestructures (884, 886) located at a first metal line level and firstmetal via structures (814, 816) located at a first metal via level thatoverlies the first metal line level. FIG. 41 illustrates the overlaybetween the first metal via structures (814, 816) located at the firstmetal via level and second metal line structures (824, 826) located at asecond metal line level that overlies the first metal via level. FIG. 42illustrates the overlay between the second metal line structures (824,826) located at the second metal line level and pad-connection-level viastructures (834, 836) located at a pad connection level that overliesthe second metal line level. FIG. 43 illustrates the overlay between thepad-connection-level via structures (834, 836) located at the padconnection level and logic-side bonding pads 2792 located at a metal padlevel that overlies the pad connection level. FIG. 44 is a verticalcross-sectional view along the vertical cross-sectional plane X-X′ ofFIGS. 40, 41, 42, and 43 of the second magnified region M2. FIG. 45 is avertical cross-sectional view along the vertical cross-sectional planeY-Y′ of FIGS. 40, 41, 42, and 43 of the second magnified region M2.

Each of the first metal line structures (884, 886), the first metal viastructures (814, 816), the second metal line structures (824, 826), thepad-connection-level via structures (834, 836), and the logic-sidebonding pads 2792 can be included in the logic dielectric material layer2760, which can include a stack of multiple dielectric materialsublayers that are component layers of the logic dielectric materiallayer 2760.

The first metal line structures (884, 886) located at the first metalline level include first source-connection metal line structures 884that are electrically connected to output nodes of the source powersupply circuit in the peripheral circuitry of the logic die 2000, andfirst bit-line-connection metal line structures 886 that areelectrically connected to nodes of a sense amplifier and bit line drivercircuit, for example, through bit-line-connection contact via structures806. The bit-line-connection contact via structures 806 can beelectrically connected to gate electrodes, source regions, or drainregions of complementary metal oxide semiconductor (CMOS) transistors ina respective sense amplifier and bit line driver circuit.

The first metal via structures (814, 816) located at the first metal vialevel include first source-connection metal via structures 814 thatcontact a top surface of a respective one of the first source-connectionmetal line structures 884, and first bit-line-connection metal viastructures 816 that contact a top surface of a respective one of thefirst bit-line-connection metal line structures 886.

The second metal line structures (824, 826) located at a second metalline level include isolated source-connection line-level structures 824that contact a respective one of the first source-connection metal viastructures 814, and second bit-line-connection metal line structures 826that contact a top surface of a respective one of thebit-line-connection metal via structures 816.

The pad-connection-level via structures (834, 836) located at the padconnection level include second source-connection metal via structures834 that contact a top surface of a respective one of the isolatedsource-connection line-level structures 824, and secondbit-line-connection metal via structures 836 that contact a top surfaceof a respective one of the second bit-line-connection metal linestructures 826.

The logic-side bonding pads 2792 can includes a pad-level mesh structure2792A electrically connected to a source power supply circuit within theperipheral circuitry through the second source-connection metal viastructures 834. The pad-level mesh structure 2792A can contact the topsurface of each second source-connection metal via structure 834. Thepad-level mesh structure 2792A may include an array of discrete openingstherethrough. Further, the logic-side bonding pads 2792 can comprisediscrete logic-side bonding pads 2792B electrically isolated one fromanother and from the pad-level mesh structure 2792A. The discretelogic-side bonding pads 2792B can contact a top surface of a respectiveone of the second bit-line-connection metal line structures 826.

A memory-containing die (1000, 1000′) described above can be providedwith memory-side bonding pads 1792. The memory-side bonding pads 1792can be arranged such that the each of the memory-side bonding pads 1792can bond with the pad-level mesh structure 2792A or one of the discretelogic-side bonding pads 2792B. The pad-level mesh structure 2792A can beprovided as a plurality of pad-level mesh structures 2792A that arelaterally spaced apart by groups of discrete logic-side bonding pads2792B. The logic-side bonding pads 2792 can be bonded to a respectiveone, or a respective subset, of the memory-side bonding pads 1792 usingany of the methods described above. In one embodiment, each of thediscrete logic-side bonding pads 2792B can be bonded to a respective oneof the memory-side bonding pads 1792, and the pad-level mesh structure2792A can be bonded to a respective plurality of memory-side bondingpads 1792 that are electrically connected to the laterally-elongatedcontact via structure 76 that are configured to distribute the sourcepower supply voltage that is provided by the source power supplycircuits in the peripheral circuitry of the logic die 2000.

In one embodiment, a second bit-line-connection metal via structure 836(as illustrated in FIG. 45 ) can contact one of the discrete logic-sidebonding pads 2792B. A second bit-line-connection metal line structure826 can contact a bottom surface of the second bit-line-connection metalvia structure 836 and can laterally extend to a region underneath aportion of the pad-level mesh structure 2792A, such as the region inwhich the second bit-line-connection metal line structure 826 underliesthe pad-level mesh structure 2792A as illustrated in FIG. 44 . A firstbit-line-connection metal via structure 816 can contact a bottom surfaceof the second bit-line-connection metal line structure 826 (asillustrated in FIG. 44 ), and can be electrically connected to a senseamplifier within the peripheral circuitry. The secondbit-line-connection metal line structure 826, the pad-level meshstructure 2792A, and the first bit-line-connection metal via structure816 can overlap one another in a plan view (such as the view of FIG. 41) along a direction perpendicular to an interface between thememory-containing die (1000 or 1000′) and the logic die 2000 asillustrated in FIG. 44 . The sense amplifiers that underlie the areas ofthe pad-level mesh structure 2792A can be connected to the bit lines 98in the memory-containing die (1000 or 1000′) without disrupting thelateral extent of the pad-level mesh structure 2792A.

A subset of the pad-connection-level via structures (834, 836), such asthe second bit-line-connection metal via structures 836, can contact arespective one of the discrete logic-side bonding pads 2792B. In oneembodiment, a single pad-level mesh structure 2792A can contact each ofthe second source-connection metal via structures 834. The singlepad-level mesh structure 2792A can provide a source power distributionnetwork within the logic die 2000 that spans the entire area of a memoryarray region within the memory-containing die (1000, 1000′) that isbonded to the logic die 2000. In one embodiment, each of the discretelogic-side bonding pads 2792B can be located within a respective openingthrough the pad-level mesh structure 2792A.

Referring to all drawings and according to various embodiments of thepresent disclosure, a three-dimensional memory device having a bondedassembly is provided, which comprises: a memory-containing die (1000 or1000′) comprising a three-dimensional memory array of memory elements(which may be embodied, for example, as portions of charge storagelayers 54 located at levels of electrically conductive layers (146,246)), a memory dielectric material layer 1760 located on a first sideof the three-dimensional memory array, and memory-side bonding pads 1792included in the memory dielectric material layer 1760 and electricallyconnected to a respective node within the three-dimensional memoryarray; and a logic die 2000 comprising a peripheral circuitry configuredto control operation of the three-dimensional memory array, logicdielectric material layers 2760 located on a first side of theperipheral circuitry, and logic-side bonding pads 2792 included in thelogic dielectric material layers 2760 and electrically connected to arespective node of the peripheral circuitry and bonded to a respectiveone, or a respective subset, of the memory-side bonding pads 1792. Thelogic-side bonding pads 2792 comprise: a pad-level mesh structure 2792Aelectrically connected to a source power supply circuit within theperipheral circuitry and including an array of discrete openingstherethrough; and discrete logic-side bonding pads 2792B electricallyisolated one from another and from the pad-level mesh structure 2792A.

In one embodiment, the discrete logic-side bonding pads 2792B areelectrically connected to a sense circuit within the peripheralcircuitry through a subset of metal interconnect structures (836, 826,816, 886, 806) included within the logic dielectric material layers2760.

In one embodiment, the sense circuit comprises multiple groups of senseamplifiers (each of which may be located in an area labeled “2-SA”) thatare laterally spaced apart one from another; each group (such as a grouplocated within four contiguous areas labeled “2-SA”) among the multiplegroups of sense amplifiers includes plural sense amplifiers; discretelogic-side bonding pads 2792B are arranged as groups of logic-sidebonding pads 2792B that overlie a respective group of sense amplifiers;and each group of logic-side bonding pads 2792B includes plurallogic-side bonding pads that are connected to an input node of arespective one of the sense amplifiers. Each among the multiple groupsof sense amplifiers can include two through sixteen, such as six throughtwelve, for example eight sense amplifiers. The number of senseamplifiers can be selected based on transistor pitch, bit line pitch andother factors. Each group of logic-side bonding pads 2792B can includethe same number (e.g., two through sixteen, such as six through twelve,for example eight) of logic-side bonding pads as there are senseamplifiers.

In one embodiment, the subset of metal interconnect structures (836,826, 816, 886, 806) comprises: pad-connection-level via structures (suchas second bit-line-connection metal via structures 836) contacting arespective one of the discrete logic-side bonding pads 2792B;interconnect metal line structures (such as second bit-line-connectionmetal line structures 826) contacting a respective one of thepad-connection-level via structures; and interconnect metal viastructures (such as first bit-line-connection metal via structures 816)contacting a respective one of the interconnect metal line structures.

In one embodiment, the memory-side bonding pads 1792 comprise: aplurality of memory-side source connection bonding pads electricallyconnected to source regions 61 within the memory-containing die (1000 or1000′) and bonded to the pad-level mesh structure 2792A; and a pluralityof memory-side bit line connection bonding pads electrically connectedto bit lines 98 within the memory-containing die (1000 or 1000′) andbonded to a respective one of the discrete logic-side bonding pads2792B.

In one embodiment, the logic die 2000 comprises: a pad-connection-levelvia structure (such as a second bit-line-connection metal via structure836) contacting one of the discrete logic-side bonding pads 2792B; aninterconnect metal line structure (such as a second bit-line-connectionmetal line structure 826) contacting a bottom surface of thepad-connection-level via structure and laterally extending to a regionunderneath a portion of the pad-level mesh structure 2792A (such as theregion in which a second bit-line-connection metal line structure 826underlies the pad-level mesh structure 2792A as illustrated in FIG. 44); an interconnect metal via structure (such as a firstbit-line-connection metal via structure 816 illustrated in FIG. 44 )contacting a bottom surface of the interconnect metal line structure andelectrically connected to a sense amplifier within the peripheralcircuitry. The interconnect metal line structure (such as the secondbit-line-connection metal line structure 826 of FIG. 44 ), the pad-levelmesh structure 2792A, and the interconnect metal via structure (such asthe first bit-line-connection metal via structure 816 illustrated inFIG. 44 ) overlap one another in a plan view (such as the view of FIG.41 ) along a direction perpendicular to an interface between thememory-containing die (1000 or 1000′) and the logic die 2000, and thepad-level mesh structure 2792A is electrically isolated from theinterconnect metal via structure and the interconnect metal linestructure.

In one embodiment, the memory-containing die (1000 or 1000′) comprises:a two-dimensional array of memory stack structures 55 including arespective vertical semiconductor channel 60 and a respective verticalstack of memory elements (comprising portions of charge storage layers54 located at levels of the electrically conductive layers (146, 246));source regions 61 electrically connected to a first end of the verticalsemiconductor channels 60; and a first subset of memory-side metalinterconnect structures 1780 electrically connecting the source regions61 to a first subset of the memory-side bonding pads 1792 that is bondedto the pad-level mesh structure 2792A.

In one embodiment, the memory-containing die (1000 or 1000′) comprises:bit lines 98 electrically connected to a second end of a respectivesubset of the vertical semiconductor channels 60; and a second subset ofmemory-side metal interconnect structures 1780 connecting the bit lines98 to a second subset of the memory-side bonding pads 1792 that isbonded to the discrete logic-side bonding pads 2792B.

In one embodiment, the three-dimensional memory array includes atwo-dimensional array of vertical NAND strings located in the memorydie; each vertical NAND string in the array of vertical NAND stringscomprises charge storage elements (such as portions of charge storagelayers 54 located at the levels of the electrically conductive layers(146, 246)) controlled by word lines (comprising a subset of theelectrically conductive layers (146, 246)) and a vertical semiconductorchannel 60; a first end portion of each vertical semiconductor channelis electrically connected to a respective source region 61 (for example,through a horizontal channel portion 59); a second end portion of eachvertical semiconductor channel 60 is electrically connected to arespective bit line; the pad-level mesh structure 2792A is electricallyconnected to each of the source regions 61; and the discrete logic-sidebonding pads 2792B is electrically connected to a respective one of thebit lines 98.

The various embodiments of the present disclosure provide a source powersupply network within a logic die 2000, and minimizes the electricalwiring requirement for source power distribution within thememory-containing die (1000 or 1000′). The electrical connections forthe bit lines 98 to the nodes of sense amplifiers and bit line driversin the periphery circuitry of the logic die 2000 can be provided byusing openings within a pad-level mesh structure 2792A or by using gapsbetween neighboring pairs of pad-level mesh structures 2792A, therebyminimizing disruption of the source power supply network on the side ofthe logic die 2000.

The various embodiments of the present disclosure provide stacking of amemory-containing die and a logic die for incorporation into a singlesemiconductor package, thereby reducing the packaging cost andincreasing the data transfer speed between the memory-containing die andthe logic die. Furthermore, thermal cycling on the CMOS devices can bereduced by separately manufacturing the memory-containing die and thelogic die, and by bonding the dies together after manufacturing thedies.

Although the foregoing refers to particular embodiments, it will beunderstood that the disclosure is not so limited. It will occur to thoseof ordinary skill in the art that various modifications may be made tothe disclosed embodiments and that such modifications are intended to bewithin the scope of the disclosure. Compatibility is presumed among allembodiments that are not alternatives of one another. The word“comprise” or “include” contemplates all embodiments in which the word“consist essentially of” or the word “consists of” replaces the word“comprise” or “include,” unless explicitly stated otherwise. Where anembodiment using a particular structure and/or configuration isillustrated in the present disclosure, it is understood that the claimsmay be practiced with any other compatible structures and/orconfigurations that are functionally equivalent provided that suchsubstitutions are not explicitly forbidden or otherwise known to beimpossible to one of ordinary skill in the art. All of the publications,patent applications and patents cited herein are incorporated herein byreference in their entirety.

What is claimed is:
 1. A semiconductor structure, comprising: a firstdie comprising a three-dimensional memory device including athree-dimensional array of NAND memory elements; and a second diecomprising a semiconductor substrate, a peripheral logic circuitry thatincludes complementary metal oxide semiconductor (CMOS) devices locatedon the semiconductor substrate, and a through-substrate via structurethat vertically extends through the semiconductor substrate and having avertical extent that is not less than a thickness of the semiconductorsubstrate; wherein: the first die is bonded to the second die; and gatestructures of the CMOS devices of the second die are located between thethree-dimensional array of NAND memory elements of the first die and thesemiconductor substrate of the second die containing active regionsseparated by a channel of the CMOS devices.
 2. The semiconductorstructure of claim 1, further comprising a third die comprisingsemiconductor devices, wherein the third die is bonded to the first dieon an opposite side of the second die.
 3. A method of forming asemiconductor structure, comprising: providing a first die comprising athree-dimensional memory device including a three-dimensional array ofNAND memory elements; providing a second die comprising a semiconductorsubstrate and peripheral logic circuitry that includes complementarymetal oxide semiconductor (CMOS) devices located on the semiconductorsubstrate; forming a bonded assembly by bonding the first die to thesecond die; and thinning the semiconductor substrate after the first dieis bonded to the second die by removing a portion of the semiconductorsubstrate that is distal from a bonding interface between the first dieand the second die.
 4. The method of claim 3, further comprising forminga through-substrate via structure through the semiconductor substrateafter the semiconductor substrate is thinned, wherein thethrough-substrate via structure has a vertical extent that is greaterthan a thickness of the semiconductor substrate after thinning thesemiconductor substrate.
 5. The method of claim 3, further comprisingattaching a third die comprising semiconductor devices by bonding thethird die to the first die, wherein the third die is attached to thefirst die on an opposite side of the second die.
 6. A semiconductorstructure, comprising: a first die comprising a three-dimensional memorydevice including a three-dimensional array of memory elements, a firstdielectric material layer overlying, or underlying, thethree-dimensional array of memory elements, and first pads embedded inthe first dielectric material layer and electrically connected to arespective node within the three-dimensional memory device; a second diecomprising a semiconductor substrate, a peripheral logic circuitry thatincludes complementary metal oxide semiconductor (CMOS) devices locatedon the semiconductor substrate, a second dielectric material layeroverlying, or underlying, the CMOS devices, and second pads embedded inthe second dielectric material layer and electrically connected to arespective node within the CMOS devices; and a third die comprisingsemiconductor devices, wherein the third die is bonded to the first dieon an opposite side of the second die, wherein the first pads are bondedwith the second pads through to provide multiple bonded pairs of arespective first pad and a respective second pad at an interface betweenthe first die and the second die; wherein the semiconductor devices inthe third die comprise: an additional three-dimensional memory deviceincluding an additional three-dimensional array of memory elements; athird dielectric material layer overlying or underlying the additionalthree-dimensional array of memory elements; and third pads embedded inthe third dielectric material layer and electrically connected to arespective node within the additional three-dimensional memory device.7. The semiconductor structure of claim 6, wherein: the first diefurther comprises additional first pads located on an opposite side ofthe first pads relative to the three-dimensional array of memoryelements; and the third pads are bonded to the additional first pads. 8.The semiconductor structure of claim 7, wherein horizontal surfaces ofthe third pads are in direct contact with horizontal surfaces theadditional first pads.
 9. The semiconductor structure of claim 5,wherein: the first die comprises a first alternating stack of firstinsulating layers and first electrically conductive layers; memoryelements within the three-dimensional array of elements are locatedwithin the first alternating stack; the third die comprises a secondalternating stack of second insulating layers and second electricallyconductive layers; and memory elements within the additionalthree-dimensional array of memory elements are located within the secondalternating stack.
 10. A semiconductor structure, comprising: a firstdie comprising a three-dimensional memory device including athree-dimensional array of memory elements, a first dielectric materiallayer overlying, or underlying, the three-dimensional array of memoryelements, and first pads embedded in the first dielectric material layerand electrically connected to a respective node within thethree-dimensional memory device; a second die comprising a semiconductorsubstrate, a peripheral logic circuitry that includes complementarymetal oxide semiconductor (CMOS) devices located on the semiconductorsubstrate, a second dielectric material layer overlying, or underlying,the CMOS devices, and second pads embedded in the second dielectricmaterial layer and electrically connected to a respective node withinthe CMOS devices; a third die comprising semiconductor devices, whereinthe third die is bonded to the first die on an opposite side of thesecond die, wherein the first pads are bonded with the second padsthrough to provide multiple bonded pairs of a respective first pad and arespective second pad at an interface between the first die and thesecond die; and a through-substrate via structure that verticallyextends through the semiconductor substrate and having a vertical extentthat is not less than a thickness of the semiconductor substrate. 11.The semiconductor structure of claim 10, wherein: the second diecomprises metal interconnect structures that are embedded within thesecond dielectric material layer; the vertical extent of thethrough-substrate via structure is greater than the thickness of thesemiconductor substrate; and the through-substrate via structure is indirect contact with one of the metal interconnect structures.
 12. Thesemiconductor structure of claim 10, further comprising a bonding pad indirect contact with the through-substrate via structure, wherein thebonding pad is vertically spaced from a bonding interface between thefirst die and the second die by a greater vertical spacing than avertical spacing between the semiconductor substrate and the bondinginterface.
 13. A semiconductor structure, comprising: a first diecomprising a three-dimensional memory device including athree-dimensional array of memory elements, a first dielectric materiallayer overlying, or underlying, the three-dimensional array of memoryelements, and first pads embedded in the first dielectric material layerand electrically connected to a respective node within thethree-dimensional memory device; a second die comprising a semiconductorsubstrate, a peripheral logic circuitry that includes complementarymetal oxide semiconductor (CMOS) devices located on the semiconductorsubstrate, a second dielectric material layer overlying, or underlying,the CMOS devices, and second pads embedded in the second dielectricmaterial layer and electrically connected to a respective node withinthe CMOS devices; and a third die comprising semiconductor devices,wherein the third die is bonded to the first die on an opposite side ofthe second die, wherein: the first pads are bonded with the second padsthrough to provide multiple bonded pairs of a respective first pad and arespective second pad at an interface between the first die and thesecond die; the first semiconductor die comprises an additionalsemiconductor substrate; and additional CMOS devices are located on theadditional semiconductor substrate.
 14. The semiconductor structure ofclaim 13, wherein: a vertical spacing between the additionalsemiconductor substrate and a bonding interface between the first dieand the second die is greater than a vertical spacing between thethree-dimensional array of memory elements and the bonding interface;and gate electrodes of the additional CMOS devices are more proximal tothe bonding interface than the additional semiconductor substrate is tothe bonding interface.